Resinlab Publishes Most Comprehensive Product Data


New print literature features complete product data for electronics market

Germantown, (WI) - Resinlab has completed print production on their new product literature intended for the electronics market. The brochure features a complete product line of adhesives and encapsulants for Electronics assembly and component protection.

The new Resinlab brochure includes comprehensive physical property data in English and International units including information on tensile strength, elongation, and modulus, compressive strength and modulus, glass transition temperature, coefficient of thermal expansion, thermal conductivity, and electrical properties. "Allowing customers to drill down to essential product specifications was top of mind in formulating this literature", says Resinlab President, Jamie Ellsworth. "Our Electronics customers appreciate physical property data when they evaluate adhesive and encapsulant material choices" continues Ellsworth.

Custom formulation, toll blending and packaging services are described in the brochure. Used for product development and quality control, Resinlab's state-of-the-art laboratory instrumentations help support customer's ever-changing electronic assembly needs.

Resinlab products are RoHS compliant and the company is ISO 9001:2008 certified. To request a copy of this comprehensive literature, call 877-259-1669 or visit www.resinlab.com.

About Resinlab:

Founded in 1988 in Germantown, Wisconsin, Resinlab is a leading resin manufacturer with state-of-the-art production equipment, lab capabilities and technical expertise. Resinlab products are sold through Ellsworth Adhesives' worldwide network of Engineered Sales Representatives throughout North America, Europe, and Asia. Working with neighbor and sister company, KitPackers, Resinlab offers the widest array in the industry of standard and custom packages of adhesives, sealants, coatings and encapsulants.

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