QUALCOMM Introduces Complete Solution for Ultra Mobile Broadband
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
5775 Morehouse Dr.
San Diego, CA, 92121
Press release date: March 27, 2007
ORLANDO, Fla., March 27 // -- QUALCOMM Incorporated (NASDAQ:QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced the addition of an end-to-end solution for Ultra Mobile Broadband(TM) (UMB(TM)) to its roadmap. QUALCOMM's next-generation Cell Site Modem(TM) (CSM(TM)) CSM8900(TM) and Mobile Data Modem(TM) (MDM(TM)) MDM8900(TM) modem chip solutions will support the latest 3GPP2 UMB standard, expected to be finalized within the first half of this year. UMB technology incorporates the benefits of OFDMA, CDMA and other air interface techniques with MIMO and advanced antenna technologies to offer features such as support for broadband speeds, greater capacity and coverage, and an enhanced user experience for future mobile services. QUALCOMM will present the industry's first over-the-air UMB demonstration in the Company's booth, #1645, at the CTIA Wireless 2007 conference in Orlando, Fla.
"QUALCOMM's commitment to driving the adoption of the newest technologies by offering the most advanced products and working closely with industry leaders remains unchanged for UMB," said Dr. Sanjay K. Jha, chief operating officer of QUALCOMM and president of QUALCOMM CDMA Technologies. "The growing base of subscribers that demand increasingly advanced services will expect the performance and new possibilities that UMB will deliver by 2009."
The MDM8900 modem solution, which will provide support for up to 40 Mbps on the downlink and 10 Mbps on the uplink, will interface with the Mobile Station Modem(TM) (MSM(TM)) MSM7850(TM) to offer a complete mobile device solution that takes advantage of new services enabled by UMB. The CSM8900 cell site solution features a new single-sector architecture and leverages QUALCOMM's Snapdragon(TM) technology for unsurpassed mobile broadband performance. The CSM8900 also supports 4x4 MIMO and serial input/output to help drive the deployment of next-generation wireless capabilities. Sampling of the MDM8900 is scheduled for the first quarter of 2008, and sampling of the CSM8900 is scheduled for the second quarter of 2008.
UMB is an evolutionary upgrade within the family of CDMA2000(R) standards that can be deployed in existing or new spectrum allocations using scalable bandwidths up to 20 MHz. Network operators can benefit from the new revenue opportunities and greater margins for mobile broadband services made possible with greater bandwidth, spectrum and band options, as well as the network scalability and flexibility that UMB offers. Wireless users will experience an enhanced mobile broadband experience with a wide range of interactive services.
QUALCOMM's live UMB booth demonstrations at CTIA Wireless 2007 will feature a variety of QoS-enabled applications running simultaneously, including high-definition video streaming, high-quality video conferencing and voice over IP, illustrating UMB's capabilities for delivering a similar multimedia experience across different devices and services. The demonstration will be the first of many reflecting the introduction of UMB for testing and trials.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. Cell Site Modem, CSM, CSM8900, Mobile Data Modem, MDM, MDM8900 and Snapdragon are trademarks of QUALCOMM Incorporated. Ultra Mobile Broadband and UMB are trademarks of the CDMA Development Group. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.
Source: QUALCOMM Incorporated
CONTACT: Kira Lee, QUALCOMM CDMA Technologies, +1-858-845-7571, firstname.lastname@example.org, or Tina Asmar, Corporate Communications, +1-858-845-5959, email@example.com
Web site: http://www.qualcomm.com/