ThomasNet Home   |   Promote Your Business
Home  |   My ThomasNet News®  |   Industry Market Trends  |   Submit Release  |   Advertise  |   About Us Feb 14, 2012  

PA&E Offers Aluminum Silicon Carbide Option for Titanium

Print | 
Email |  Comment   Share  

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Pacific Aerospace & Electronic
434 Olds Station Rd.
Wenatchee, WA, 98801
USA



Press release date: October 28, 2008

Wenatchee, WA - October 28, 2008 - Titanium composite technology can produce electronic packages that are stronger and more reliable than aluminum alternatives, however, titanium's thermal dissipation characteristics are inadequate for some applications. PA&E offers engineers the option of using integrated molybdenum/copper heat sinks and now, for applications where weight is a primary consideration, the company is offering an aluminum silicon carbide heat sink option.

AlSiC offers thermal properties similar to those of MoCu at 180 - 200 W/mK, but is one third to one-fifth as dense, offering significant weight savings. The implementation process begins during initial design phase, when the package's electronic circuitry is mapped against the housing floor and where locations that will be exposed to the highest temperatures are identified. The AlSiC composite heat sinks are then metallurgically bonded to the housing only in the locations where the housing comes into contact with the high-power devices. This limited use of the heat sink material minimizes the overall mass of the package. The package is then machined, finished and plated with no visible signs of the heat sinks on the finished product.

Since titanium composite material does not require mold tooling or diamond machining, it can be incorporated into new designs with very limited nonrecurring tooling, making the prototype phase more economical than would be possible with competitive technology. Those characteristics, combined with the low-coefficient of thermal expansion (CTE), and high-thermal-conductivity AlSiC heat sinks provide a rugged, reliable, high-performance electronic packaging alternative.

For more information about PA&E's AlSiC heat sink capabilities or to learn about other integrated electronic packaging solutions, custom interconnect products, capabilities or EMI filter product line, contact the company at 509-664-8000 or visit at http://www.pacaero.com.

PA&E, Inc. is an integrated manufacturing company, specializing in technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries. PA&E is ISO 9001:2000/AS9100 Rev B certified and NADCAP compliant.

PA&E - 434 Olds Station Road - Wenatchee, WA - 98801 - Tel: 509-664-8000 - Fax: 509-664-6868
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
 Newsletters
Industry Market Trends
Has Got It
  • Latest developments
  • Trends
  • Best practices
  • Opinions & Commentary
Get Ahead. Get IMT.
Subscribe Free Today
Subscribe   View Sample

Your Gateway to a Fast Changing World
Product News Alerts
Receive similar stories and other customized news to keep you in the know on the products shaping industry.
Subscribe Free Today
Subscribe   View Sample
 See more product news in:
Computer Hardware and Peripherals
Thermal and Heating Equipment
 More New Product News from this company:
Testing Standards apply to space qualified EMI filters.
Miniature Micro-D Connector has hermetic, MIL spec design.
Micro-D Connectors target non-magnetic applications.
Hermetic Receptacle features aluminum compatible design.
Hermetic Feedthrough is used with fiber optic connectors.
More ....
 Other News from this company:
PA&E Highlights Explosive Metal Welding at APS' March Exposition
PA&E Announces Hermetic Mate for Souriau's MicroComp Connector Series
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-Mail Story
Save Story
Search for suppliers of
Printed Circuit Board (PCB) Heat Sinks
Composite Heat Sinks
Join the forum discussion at:
The Factory Floor


Home  |  My ThomasNet News®  |  Industry Market Trends  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2012 Thomas Publishing Company
Terms of Use - Privacy Policy