PA&E Announces Hermetic Mate for Souriau's MicroComp Connector Series |
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Pacific Aerospace & Electronic
434 Olds Station Rd.
Wenatchee, WA, 98801
USA
Press release date: October 9, 2008
Souriau's innovative microComp series of high-density, light-weight, space-saving rectangular connectors can now be deployed in applications that require a hermetic seal, thanks to PA&E's new hermetic microComp mate.
"The microComp connector series offers a number of unique features, but it wasn't an option for engineers designing components that required hermetic sealing," said Ed Phinney, Vice President of Engineering at PA&E. "We partnered with Souriau, and leveraged our expertise in ceramic-to-metal sealing technology, to create a hermetic mate for the microComp line that gives design engineers working in the space and defense industries a new, high-performance, hermetic connector option."
Souriau's microComp connector line is well suited to any application that requires a light-weight, high-density rectangular connector. It weighs 60% less and is 25% smaller than standard high-density Sub-D connectors. It can be built with as few as seven or as many as 104 contacts with a contact pitch of 2.0 x 1.7 mm2. The microComp line comes in both space and military grade configurations and each connector offers dismountable contact construction for wiring flexibility
The PA&E microComp hermetic mate can be built to match any microComp configuration. It has a leak rate of less than 1X10-9 cc/second helium at one atmospheric differential pressure thanks to PA&E's proprietary Kryoflex® polycrystalline ceramic. Kryoflex-sealed connectors provide superior electrical performance -- up to 70 times the current-carrying capacity of conventional products -- while withstanding extreme mechanical and thermal stresses.
These connectors provide an insulation resistance of greater then 5,000 megohms at 500 VDC when tested in IAW MIL-STD 1344, Method 3003. They are built with beryllium copper alloy contacts that are finished in nickel/gold. The microComp mate is designed for aluminum, titanium or iron/nickel alloy applications and has an operating temperature range of -65° C to 200° C.
For more information about PA&E's custom interconnect products, integrated electronic packaging capabilities or EMI filters product line, contact the company at 509-664-8000 or visit at http://www.pacaero.com.
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