ThomasNet Home   |   Promote Your Business
Home  |   My ThomasNet News®  |   Industry Market Trends  |   Submit Release  |   Advertise  |   About Us May 25, 2012  

Novellus Announces Availability of the Webcast of Its Presentation at the 13th Annual Needham Growth Conference

Print | 
Email |  Comment   Share  

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Novellus Systems, Inc.
81 Vista Montana
San Jose, CA, 95134
USA



Press release date: December 22, 2010

SAN JOSE, Calif., Dec. 22, 2010 - Novellus Systems, Inc. (Nasdaq: NVLS) today announced that the company will present on Thursday, January 13, 2011, at the 13th Annual Needham Growth Conference. The presentation will begin at 10:40 a.m. EST and will be made available over the Internet via a live webcast.

The live webcast presentation may be accessed via Novellus' Investor Relations home page at www.novellus.com/. A replay of the webcast will be available for seven days following the conference.

About Novellus:

Novellus Systems, Inc. (NASDAQ: NVLS) is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices across the globe. For more information please visit www.novellus.com.

SOURCE Novellus Systems, Inc.

CONTACT:
Investor Relations,
Robin S. Yim of Novellus Systems, Inc.,
+1-408-943-9700
Web Site: http://www.novellus.com
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



Start Your Free
Subscription to
Industry Market Trends.
 More New Product News from this company:
PECVD System supports sub-28 nm dielectric films.
Double Side Lapping System aids silicon wafer manufacturing.
High-Throughput PECVD System serves semiconductor industry.
3D Electroplating System simplifies wafer level packaging.
Tungsten Nitride Film lowers via resistance on memory chips.
More ....
 Other News from this company:
Novellus Systems, Inc. Announces Participation at Investor Conferences
Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications
Novellus' Suppression-Enhanced Fill(TM) Technology Provides Defect-Free 32nm Copper Interconnects
Novellus, ATMI and Enthone Introduce Enhanced Electrochemical Deposition Process for Copper
More ....
 Tools for you
Watch Company 
View Company Profile
More news from this company
E-Mail Story
Save Story


Home  |  My ThomasNet News®  |  Industry Market Trends  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2012 Thomas Publishing Company
Terms of Use - Privacy Policy



Error close

Please enter a valid email address