Nordson DAGE to Exhibit XD7600NT100HP X-Ray Inspection System at National Electronics Week South Africa
The most technologically advanced X-ray inspection system on the market
Aylesbury, Buckinghamshire, UK - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) and the industry leader in X-ray inspection technology, is pleased to announce that its award-winning XD7600NT100HP X-ray inspection system will be exhibited on Stand No. H11 at National Electronics Week (NEW) South Africa scheduled to take place 9 - 10th March 2010 in Sandton, Johannesburg.
The new XD7600NT100HP is the most technologically advanced X-ray inspection system on the market today with groundbreaking 100 nanometer (0.1 micron) feature recognition for finite analysis of the most challenging inspection applications. Equipped with a 2.0M pixel digital imaging system, the XD7600NT100HP offers oblique angle viewing of up to 70-degrees around any point of a 16"x18" (407x458mm) inspection area without compromising magnification.
The XD7600NT100HP combines the superior digital acquisition technology of the Nordson DAGE XiDAT 3.0 imaging system with Nordson DAGE's award winning and easy to use ImageWizard software for world class inspection quality. It is configured with dual monitors. This allows operators to view the all important X-ray image on a 24" widescreen LCD monitor while at the same time providing the location of faults on a highly detailed, full screen display of the X-ray navigation map of the sample on the second LCD display. The system is available with a high-power tube combining 10 watts of power and genuine sub-micron feature recognition. Unlike existing high power tubes that have to significantly compromise resolution when used at higher power levels, this new Nordson DAGE high-power NT tube retains sub-micron feature recognition at full power.
The XD7600NT100HP can be equipped with computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints, ideally suited for analytical investigation of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package.
