Nordson DAGE's New X-Plane(TM) Technology Wins Its Third Industry Award
28601 Clemens Rd.
Westlake, OH, 44145
Press release date: October 1, 2012
Aylesbury, Buckinghamshire, UK - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is delighted to announce that it has been awarded a 2012 Global Technology Award in the category of Software - Production for its X-Plane(TM) Analysis - Sub Micron X-Ray Inspection System Option. The award was presented to the company on Tuesday, October 16, 2012 at a ceremony that took place at the Walt Disney World Dolphin Hotel in Orlando, FL during the 2012 SMTA International Conference.
X-Plane(TM) is a revolutionary option for Nordson DAGE's range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane(TM) technology is quick, simple and easy-to-use.
The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane(TM) shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
About Nordson DAGE
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
About Nordson Corporation
Nordson Corporation delivers precision technology solutions that help customers increase speed, productivity and up-time, enable new products and features, and decrease material usage. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson at www.nordson.com, twitter.com/Nordson_Corp, or Facebook.com/Nordson.