Nordson DAGE Sweeps the Industry Award Programs with Four Consecutive Awards
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Amherst, OH, 44001
Press release date: April 1, 2014
• Advanced technology on the 4000 Optima bondtester guarantees ultimate speed and flexibility
Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Test Instruments for its 4000 Optima Bondtester with Unique Multi-function Cartridge. The award was presented to the company during an April 24, 2014 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. In the last year, Nordson DAGE Bond Test also has won a Global Technology Award, Circuits Assembly NPI Award and SMT China Vision Award.
While heralding progression in bond testing technology, the 4000 Optima Bondtester's heritage is built upon the established Nordson DAGE 4000 test platform, so users can be assured that test data will correlate between the two systems without compromising data integrity. Additionally, the 4000 Optima is compatible with many of the 4000 and 4000Plus load cartridges including the unique multi-function cartridge (MFC). The MFC expands the versatility of manual testing on the 4000 Optima, enabling ultra-quick application changeover.
Tests are faster with the 4000 Optima's unique vector nudge controls, utilizing the newly styled key pad featuring programmable nudge buttons for precise positional alignment. The customizable software allows specific user profiles to be set-up making the changeover between operators quicker and easier.
Established in 2006, the EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.
For more information about Nordson DAGE, visit www.nordsondage.com.
About Nordson DAGE
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.