Nextreme Expands Manufacturing Capacity to Meet Flip Chip Demand |
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Nextreme Thermal Solutions
3908 Patriot Drive, Suite 204
Durham, NC, 27003
USA
Press release date: October 23, 2007
Relocation signals manufacturing milestone and ramp-up of volume production
Research Triangle Park, N.C. (October 23, 2007) - Nextreme, a manufacturer of micro-scale thermal and power management products for the electronics industry, is relocating and expanding its North American corporate headquarters and manufacturing facility within Research Triangle Park. Increasing Nextreme's production capacity, the 14,000 square-foot, state-of-the art facility includes semiconductor grade clean rooms and an advanced application laboratory to better serve customer needs as Nextreme enters product qualification, pilot production and ultimately volume production.
"To meet market demands, we are relocating to facilitate the evolution of our technology into full-scale production," said Jim Mundell, Nextreme Chief Operating Officer. "Our recently announced Thermal Copper Pillar Bump removes the barriers to large scale implementation of embedded thermal and power management in flip chip applications, which represents exponential growth for Nextreme."
Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. This breakthrough in flip chip process technology, addresses two of the most serious issues in electronics today - thermal and power management. Nextreme's approach uses a proven, fully scalable technology to deliver new, enabling functionality in flip chip applications.
The flip chip market is one of the largest and fastest growing semiconductor packaging industry market segments. Potential flip chip applications for Nextreme's thermal bump include microprocessors, display drivers, chip sets, RF devices, medical devices, watches, smartcards and analog/mixed signal devices.
Nextreme's new facility is located at 3908 Patriot Drive, Durham, NC 27703. Nextreme expects to complete the move by the end of December 2007.
For more information, contact Nextreme at 3040 Cornwallis Road, P.O. Box 13981, Research Triangle Park, NC 27709-3981; call (919)-990-8300; e-mail info@nextreme.com; or go to www.nextreme.com.
About Nextreme, Inc.
Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme's breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry.
Nextreme is managed by an experienced start-up team and world-renowned experts in electronics, thermal management and pillar bump technology. The company has 38 employees and is based in Research Triangle Park, North Carolina.
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