New White Paper From Toshiba Details How to Build a Digital-to-Analog Converter Box With TC90407XBG-Based Solutions
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Toshiba America Electronic Components (TAEC)
9775 Toledo Way
Irvine, CA, 92618-1811
Press release date: May 7, 2007
SAN JOSE, Calif., May 7: Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the publication of a new white paper entitled "Building a Digital-to-Analog Converter Box with Toshiba TC90407XBG-Based Solutions."
Authored by Deepak Prakash, director of strategic marketing for the Digital Multimedia Group at TAEC, the white paper looks at the implications of the Congressional mandate to end analog TV transmission on February 17, 2009 that is fueling significant demand for digital-to-analog converter boxes to allow use of existing analog TVs with over-the-air reception. He examines the changing environment, explains the technical requirements to build a government-compliant converter box, and describes the production-ready Toshiba TC90407XBG-based solutions to enable ODMs and OEMs to take advantage of this lucrative market opportunity.
The white paper can be accessed and downloaded from the TAEC website at: http://www.toshiba.com/taec/components/WhitePaper/TC90407XBG_WP.pdf
About the TC90407XBG Digital TV SoC and Solutions
TAEC designed a highly integrated, cost-competitive ASSP, the TC90407XBG digital TV SoC, optimized for converter-box type applications where an Advanced Television Standards Committee (ATSC) signal is converted to a National Television Standards Committee (NTSC) signal. TC90407XBG can perform vestigial sideband demodulation, MPEG transport, audio and video processing, video scaling and video-signal conversion from ATSC to NTSC. This minimizes the number of external components required to build a converter box. In addition, TAEC designed a production-ready reference board based on the TC90407XBG. Comprised of a complete hardware and software solution, this module reduces the manufacturer's design-cycle time and engineering expense. This board incorporates all the features required by the Department of Commerce's National Telecommunications and Information Administration and most of the permitted optional features(1). This enables the manufacturer to determine the best combination of features versus cost. Toshiba also offers a software development kit with a documented application program interface to allow the manufacturer to provide value-added functions and add its own look and feel to the user interface.
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.
TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's largest semiconductor manufacturer and the world's fourth largest semiconductor manufacturer. In more than 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
Source: Toshiba America Electronic Components, Inc.
CONTACT: Judy Kahn, +1-650-948-8881, email@example.com, Toshiba America Electronic Components, Inc.; Deborah Chalmers Toshiba America Electronic Components, Inc., +1-408-526-2454, firstname.lastname@example.org Web site: http://www.chips.toshiba.com/