NEC Electronics America to Exhibit Wireless USB, PCI Express and Memory Solutions at IDF Fall 2006 |
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NEC Electronics
2880 Scott Blvd.
Santa Clara, CA, 95050
USA
Press release date: September 26, 2006
Advanced Interface and Advanced Memory Buffer Technologies Showcased
INTEL DEVELOPER FORUM, SAN FRANCISCO, Sept. 26 / -- NEC Electronics America, Inc. today announced it will exhibit its PCI Express(TM), Wireless USB and advanced memory buffer (AMB) technologies in separate communities at the Intel Developer Forum (IDF) Fall 2006, September 26-28, at the Moscone Center West in San Francisco (booth numbers listed below). Demonstrations will feature the company's Wireless USB technology based on the Certified Wireless USB specification, PCI Express switch and bridge application-specific standard products (ASSPs) and fully buffered dual inline memory modules (FB-DIMMs) with NEC Electronics' AMB on a server platform.
Booth Demonstrations (1) PCI Express Description: NEC Electronics America will highlight its PCI Express technologies in a high-speed data transfer demonstration featuring an NEC Electronics PCI Express-to-PCI-X bridge chip and PCI Express-to-PCI Express switch ASSP. Location: PCI Express Community, Booth # 532
(2) Wireless USB Description: NEC Electronics America will showcase Wireless USB technology in a demonstration of its CardBus-type host controller based on Certified Wireless USB and a new device wire adapter with four USB 2.0 downstream ports. Location: Certified Wireless USB Community, Booth # 940
(3) AMB Description: NEC Electronics America will highlight the full functionality of FB-DIMMs in a demonstration of a live FB-DIMM with NEC Electronics' AMB on a server platform. Location: Memory Implementers Forum Community, Booth # 238
NEC Electronics' PCI Express ASSPs and ASIC Core Solutions
NEC Electronics is committed to PCI Express technology and provides complete solutions. In 2002, NEC Electronics America was the first company to demonstrate a PCI Express PHY chip and endpoint controller core based on NEC Electronics' proven serializer/deserializer (SerDes) technology. PCI Express ASSPs include various switch and bridge chips. More information about NEC Electronics America's products using PCI Express technology can be found at http://necel.com/pci_express.
NEC Electronics' Wireless USB Products
NEC Electronics is a leading supplier of USB solutions for worldwide customers and was the first company to introduce a USB 2.0 host controller, hub controller and device controller. With a USB 2.0 product lineup that includes ASSPs and ASICs, the company has shipped more than 80 million USB 2.0 products. NEC Electronics continues to drive the development of next- generation interface technology and is working with the Wireless USB Promoter Group to standardize specifications for Wireless USB. The company also announced today its new device wire adapter (DWA) LSI chip (part number uPD720180) to enable the connection of wired USB peripherals, such as a mouse or printer, to systems based on the Certified Wireless USB specification. In addition, the DWA chip can be combined with NEC Electronics' uPD720170 host controller chip that will enable designers to easily implement a complete system. The host controller enables high-speed wireless transmission of data between personal computers (PCs) and PC peripherals such as printers, external storage equipment and digital cameras. The host controller will be used for mobile phones and other consumer-type electronic devices as Certified Wireless USB technology is adopted in those markets. The company is also working with partners to develop a prototype high-speed Wireless USB product with ultra- wideband technology as the physical layer. More information about NEC Electronics America's products based on Certified Wireless USB technology can be found at www.am.necel.com/wusb.
NEC Electronics' Advanced Memory Buffer
Fully compliant with the AMB standard ratified by JEDEC, NEC Electronics' AMB device is a key enabling technology behind the increased bandwidths and large memory capacities characteristic of emerging FB-DIMM products. The device's unique channel structure mitigates buffer latency issues typical of registered DIMM memory, enabling higher levels of memory performance for applications such as servers, routers and graphics controllers. NEC Electronics is working closely with the industry's leading DRAM and FB-DIMM manufacturers to further develop the FB-DIMM market and help drive FB-DIMMs as the next-generation memory platform for server applications. More information about NEC Electronics America's products using AMB technology can be found at www.am.necel.com/amb.
About NEC Electronics America, Inc.
NEC Electronics America, Inc., headquartered in Santa Clara, California, is a wholly owned subsidiary of NEC Electronics Corporation , a leading provider of semiconductor products encompassing advanced technology solutions for the broadband and communications markets; system solutions for the mobile, PC, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics America offers local manufacturing in Roseville, California, and the global manufacturing capabilities of its parent company. In the Americas, NEC Electronics America markets and sells industrial-type active-matrix LCDs from NEC LCD Technologies, Ltd., a global leader in innovative display technologies. More information about the products offered by NEC Electronics America can be found at http://www.am.necel.com/.
Source: NEC Electronics America, Inc.
CONTACT: Klaudeen Shemirani NEC Electronics America, Inc. +1-408-588-5402 klaudeen.shemirani@am.necel.com
Jessica Kerr Porter Novelli +1-408-369-4600, ext. 637 jessica.kerr@porternovelli.com, for NEC Electronics America, Inc.
Web site: http://www.necel.com/
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