Multisorb to Attend IMAPS 2012 Southeastern Microelectronics Packaging Conference |
Multisorb Technologies, Inc.
325 Harlem Rd.
Buffalo, NY, 14224
USA
 
Press release date: December 22, 2011
Buffalo, New York, December 22, 2011 - Multisorb Technologies has announced they will be attending International Microelectronics and Packaging Society's (IMAPS) 2012 Southeastern Microelectronics Packaging Conference. The conference is being held on January 17, 2012 at the Rosen Centre Hotel in Orlando, Florida. The conference provides a forum for experts to discuss the latest advances and emerging applications in microelectronics and high density packaging.
Multisorb will be on hand to discuss options for extending service life and increasing the reliability of electronic devices and assemblies through the use of sorbent solutions. If you are designing an electronic product or have found that moisture, oxygen, and other contaminates are damaging your electronic products and components, Multisorb can design a solution specific to your need. Multisorb's research and development scientists have extensive experience working with many electronics manufacturers to develop solutions for a variety of products such as hard disk drives, cameras, instrumentation, lasers, refrigeration, and more. With Drop-In, Fit-In, and Built-in formats available, a customizable format is available to fit your product's needs.
Stop by and talk to us. The only thing you have to lose is unwanted moisture and contaminates.
About Multisorb Technologies
Multisorb Technologies has been an innovator in active packaging technology for 50 years. Founded in 1961 by John S. Cullen to protect products against the damaging effects of moisture, today Multisorb is the world leader in the development and production of active packaging components.
Multisorb's corporate offices are located at 325 Harlem Road, Buffalo, New York 14224 USA. For more information contact: Phone: +1 716-824-8900; Fax: +1 716-824-4128; E-mail: info@multisorb.com; Website: www.multisorb.com.
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