Montage Technology Introduces the Industry's First JEDEC 0.92 Specification Compliant DDR4 Registering Clock Driver and Data Buffer for DDR4 RDIMMs and LRDIMMs
Montage Technology Group
2025 Gateway Place, Suite 262
San Jose, CA, 95110
Press release date: July 30, 2013
SHANGHAI – Montage Technology, a global fabless provider of analog and mixed-signal semiconductor solutions for the home entertainment and cloud computing markets, has introduced the industry's first production ready dual-mode DDR4 Registering Clock Driver (RCD) that supports both Registered Dual In-line Memory Module (RDIMM) and Load Reduced DIMM (LRDIMM) modes for use in next generation server platforms. The RCD is fully compliant with the JEDEC 0.92 specification which defines a single central RCD device that can be used independently on a RDIMM or in conjunction with nine Data Buffers (DB) on an LRDIMM.
Montage has delivered DDR4 RDIMMs and LRDIMMs to key industry players from multiple DRAM suppliers. "Intel has been working with memory ecosystem partners to enable DDR4," said Geof Findley, Director of Memory Enabling and Apps Engineering at Intel, "and the Montage buffer is the first JEDEC 0.92 compliant part running on 32GB Quad Rank x4 DDR4 LRDIMMs providing higher capacity and lower power memory solutions."
"Montage is pleased to be a partner with Intel in providing the next generation DDR4 memory solutions," said Stephen Tai, President of Montage Technology Group. The new DDR4 JEDEC architecture is the first industry standard to enable a common central RCD for both RDIMMs and LRDIMMs thereby maximizing scalability in next generation servers. The new JEDEC standard LRDIMM architecture also provides a compelling advantage as each data byte lane is isolated or buffered allowing higher speed operation than capable on a standard RDIMM.
Product Availability - Production candidate customer samples of the DDR4 Register, Montage part number M88DDR4RCD01, are available now in a 253-ball Flip-Chip Fine-Pitch BGA package. The DDR4 Data Buffer, M88DDR4DB01, is also available now in a 53-ball Flip-Chip Fine-Pitch BGA package.
About Montage Technology - Montage Technology is a global fabless provider of analog and mixed-signal semiconductor solutions currently addressing the home entertainment and cloud computing markets. Montage provides memory interface products that are used in server and cloud based applications including DDR3 Registers, DDR3 Memory Buffers (MB), DDR4 Registers (RCD) and DDR4 Data Buffers (DB). Montage works closely with the world's leading server OEMs and DRAM manufacturers to provide high performance, low power memory interface solutions that enable memory intensive server applications.
For more information regarding Montage please visit the company's website at www.montage-tech.com.
Montage Technology Group
Web Site: http://www.montage-tech.com