MagnaChip Offers Enhanced 0.18um Process Technology |
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MagnaChip Semiconductor
1, Hyangjeong-dong, Hungduk-gu
Cheongju-si,Chungbuk, Korea (south)
Press release date: July 11, 2006
SEOUL, South Korea, July 11 /-- MagnaChip Semiconductor, a leading specialty foundry service provider, announced today the enhancement of its 0.18um process technology capabilities. The latest innovations include an expanded range of high voltage levels with fully-isolated HVNMOS (High Voltage N-Channel Metal Oxide Semiconductor) and versatile optional devices, as well as triple gate for analog and mixed signal applications.
MagnaChip offers 0.18um 16V, 20V, 25V, 30V high voltage processes with a cost-effective 3.27um2 embedded SRAM (Static Random Access Memory) cell and trimming memory option for display drivers and power management applications. The embedded SRAM cell, using 0.18um FEOL (Front End of Line) and 0.15um BEOL (Back End of Line), delivers chip-size benefits to customers with easy replacement compared to other foundry service providers and, in addition, offers price competitiveness. MagnaChip also plans to provide various MV (Medium Voltage) devices (6V, 7V, 8V) for wide-angle DDI (Display Driver Integrated Circuit) products such as DMB (Digital Media Broadcasting), PMP (Portable Media Player), and PDA (Personal Digital Assistant) applications.
Further, MagnaChip offers a fully industry-compatible 0.18um process in a wide range of device dimensions, bias conditions, and temperatures. This minimizes the re-design of many existing analog and digital IPs. The triple gate oxide process for 1.8V/3.3V/5V is also available with industry compatible device characteristics so that all existing IPs are re-usable. This process provides design flexibility and chip size reduction where 1.8V, 3.3V and 5V are necessary. 0.16um process, a lower cost version of 0.18um process, is also available with fifteen percent area advantage vs. existing 0.18um designs. 0.16um process is available in both a standard (1.8V) and low voltage version (1.5V).
Channy Lee, Executive Vice President of the Semiconductor Manufacturing Services Division at MagnaChip Semiconductor commented, "MagnaChip has enhanced its 0.18 technology in the area of high voltage, low power and mixed-signal. These enhancements provide a competitive edge to our customers in the growing mobile, display and power management markets."
About MagnaChip Semiconductor
MagnaChip Semiconductor is a leading designer, developer and manufacturer of mixed-signal and digital multimedia semiconductors addressing the convergence of consumer electronics and communications devices. We focus on CMOS image sensors and flat panel display drivers, which are complex, high performance, mixed signal semiconductors that capture images and enable and enhance the features and capabilities of both small and large flat panel displays. MagnaChip also provides wafer foundry services utilizing CMOS high voltage, embedded memory, analog and power process technologies for the manufacture of IC's for customer-owned designs. MagnaChip has world-class manufacturing capabilities and an extensive portfolio of approximately 11,900 registered and pending patents. As a result, MagnaChip is a valued partner in providing leading technology solutions to its customers worldwide. For more information, visit http://www.magnachip.com/.
CONTACTS: In Korea: Youngjae Chang, PR Manager Tel: 82-2-3459-5884 youngjae.chang@magnachip.com
In the U.S.: David Pasquale, EVP at The Ruth Group Tel: +646-536-7006 dpasquale@theruthgroup.com
Source: MagnaChip Semiconductor
Web site: http://www.magnachip.com/
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