Laird Technologies to Attend Electronica 2010 Trade Show |
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Laird Technologies
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
USA
Press release date: November 1, 2010
Company to Showcase Entire Product Portfolio and Hold Press Conference
St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the electronica 2010 trade show. The trade show will be held at the New Munich Trade Fair Centre in Munich, Germany, November 9-12, 2010. Laird Technologies will exhibit in both Hall A2, booth #171 and in Hall A4, booth #W15-W16. During the event, the company will also hold a press conference on November 10, 2010 from 2:00 pm - 3:00 pm in the Press Center West press conference room.
Each booth at the tradeshow will highlight different portions of Laird Technologies' portfolio. Hall A2, booth #171 will feature products and capabilities from the EMI, Signal Integrity, Specialty Metal, and Thermal Management product lines. World-class technicians will be on-hand to assist all visitors and answer questions regarding the vast capabilities the company offers, especially regarding the creation of customized solutions that can be designed specifically for any product. Attendees will also be able to browse the LairdTech.com Website at one of two self-serve kiosks and enjoy multi-media presentations featuring Laird Technologies' global corporation.
The same high-level expertise will be available in Hall A4, booth #W15-W16, where the focus will be on the Infrastructure Antenna Systems and Telematics & Wireless M2M product lines. The experts at this location will also highlight the company's capabilities and product offerings as well have demonstrations available, showcasing product application.
The press conference will highlight new products, current products, technology trends, and the company's presence in the electronics industry. New products to be announced by Laird Technologies at electronica 2010 include board-level shielding (BLS), fingerstock, electrically conductive elastomers (ECEs), Fabric-over-Foam (FoF), thermal interface materials (TIMs), and infrastructure antennas. Company representatives and technologists will be available at the session to answer any questions.
About Laird Technologies, Inc. Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.
Contact Information
For additional information, visit http://www.lairdtech.com or contact us at: Corporate Headquarters: +1 (636) 898-6000 or +1 (866) 928-8181 or dlmarcom@lairdtech.com
Editorial Contact: Matt Judkins Marketing Director Tel: 636-898-6048 matt.judkins@lairdtech.com
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