Indium Corporation's Engineered Solder Material Expert to Present at SMART, ESTC Conferences |
Indium Corporation
34 Robinson Rd.
Clinton, NY, 13323
USA
Press release date: September 13, 2012
Indium Corporation's Technical Manager for European Operations Karthik Vijay will present at two upcoming technical conferences in the United Kingdom and the Netherlands.
Vijay's first presentation is at the SMART Group European Conference and Exhibition in Thame, Oxfordshire, UK, on September 18. The presentation, Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Window, focuses on solder paste performance requirements for some sophisticated defects, such as head-in-pillow and graping. He will also discuss the use of engineered solder preforms to fortify the solder joint.
Vijay's second presentation is at ESTC in Amsterdam, the Netherlands, on September 20. This presentation, Power Electronics - Solder TIMS for Superior Thermal Management, discusses the superior performance of solder-thermal interface materials (TIMs) versus thermal grease and pads in power electronics (IGBT, RF, microwave modules). Vijay is based in the UK and is responsible for Indium Corporation's technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, TIMs, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally.
The SMART Group promotes the advancement of the electronics manufacturing industry through education, training, and notification of its members in surface mount and related assembly technology, and by the promotion of a community of electronics manufacturing professionals.
The ESTC conference series is the premier global European event that brings together key professionals working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly, interconnection technology, and new innovative applications.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium, and tin compounds, and high purity metals; and Reactive NanoFoilŪ. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
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