Indium Corporation Wins Global Technology Award
Indium Corporation has received the Global Technology Award for its NF260 No-Flow Underfill. Sponsored by Global SMT & Packaging magazine, the award recognizes product excellence and innovation in semiconductor packaging and electronics assembly. It was presented at Productronica in Munich, Germany.
NF260 is the world's first Reworkable, Air Reflowable, Pb-Free No-Flow Underfill. It is designed for Chip Scale Package (CSP) and BGA or Flip-Chip assemblies using a single reflow process. NF260 offers both a fluxing and underfilling capability for the chip while providing increased reliability and environmental protection.
Designed for Pb-Free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing. The underfill curing is completed in one reflow pass and no post-cure is required. NF260 reduces costs when compared to capillary flow underfills, and also achieves higher yields.
Two trends are converging and driving the need for more advanced PCB assembly materials:
Pb-Free: Higher soldering temperatures make no-flow underfilling more difficult, while greater solder rigidity makes underfilling more necessary.
Miniaturization & Portability: Portability demands greater crack-resistance in drop tests, hence a greater need for underfilling.
NF260 satisfies both these needs. To learn more about NF260 visit www.indium.com/nf260
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com
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