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Indium Corporation Technology Experts to Present at Southeast Asia Technical Conference

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Indium Corporation
34 Robinson Rd.
Clinton, NY, 13323
USA



Press release date: April 2, 2014

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager – Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.

Dr. Lee will teach two professional development courses. His first course, Electromigration – the Hurdle for Miniaturization and High Power Devices, examines the electromigration phenomenon in miniaturized electronics, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, composition, volume, the resistance of solder joints, and more.

Dr. Lee’s second course, Achieving High Reliability of Lead-Free Soldering – Materials Consideration, talks about materials considerations required for achieving high-reliability lead-free solder joints. Emphasis is placed on understanding how various factors contribute to failure modes and how to select the proper solder alloys and surface finishes to achieve high-reliability.

Sze Pei will present Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys. Her presentation explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test performance, and voiding performance of these alloys were evaluated against their reflow profile.

Sehar will present The Second Generation Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn. This presentation discusses the considerable improvement in shock resistance and thermal fatigue performance of a new solder alloy doped with Mn.

For more information about these presentations or to register for the conference, visit www.smta.org/southeast-asia.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.

Sze Pei is responsible for managing Indium Corporation’s technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an Area Technical Manager. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.

Sehar provides field technical support to Indium Corporation’s customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in the factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoilŪ. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Contact:
Anita Brown, Corporate Communications
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524a
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com
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