Indium Corporation Technology Experts to Present at APEX
34 Robinson Rd.
Clinton, NY, 13323
Press release date: February 27, 2014
Several Indium Corporation technology experts will present at IPC APEX March 25 – 27 in Las Vegas, Nevada.
Dr. Ning-Cheng Lee, vice president of technology, will give two presentations. His first presentation, Low Cost High Reliability Assembly of POP with a Novel Epoxy Flux on Solder Paste, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when exposed to drop shock.
Dr. Lee’s second presentation, Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloys in BGA Assembly, reviews data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions.
Tim Jensen, senior product manager for engineered solders, will teach a professional development course entitled Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP Voiding Challenges. This course will cover many of the factors that contribute to the three most challenging lead-free assembly defects and how to optimize processes and material to reduce the potential for these issues. It also includes a thorough discussion of the mechanisms leading to these defects and why they are more prevalent today than in the past.
Dr. Andy Mackie, senior product manager for semiconductor assembly materials, will present Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices. This presentation explores emerging materials, processes, and failure modes in evanescent materials relevant to waferlevel packaging, ball-grid array, flip-chip, as well as 2.5D and 3D. It will also discuss critical caps in criteria for quantifying materials performance that needs to be addressed as the industry expands into the era of dimensional 2.5D and 3D devices.
Eric Bastow, assistant technical manager, will present The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues. In his presentation, Bastow will talk about the effect of reflow profiling on the electrical reliability of no-clean flux residues that can be measured using IPC J-STD-004[1 surface insulation resistance (SIR) testing using both halogen-free (ROL0) and halogen-containing (ROL1) Pb-free no-clean solder paste.
Additionally, several Indium Corporation technology experts have been selected to give poster presentations and serve as session chairs.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has over 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Andy has a doctorate in physical chemistry from the University of Nottingham, UK, and a master of science (MSc) in colloid and interface science from the University of Bristol, UK. Additionally, he is formally trained in Six Sigma – Design of Experiments.
Bastow provides technical support for Indium Corporation’s full range of solder products for electronics assembly, semiconductor package, and thermal management markets. He is a certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. Bastow is a certified IPC-A-600 and 610D specialist.
For more information about the presentations or to register for the conference, visit www.ipcapexexpo.org.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoilŪ. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org.
Contact: Anita Brown, Corporate Communications
tel: +1.315.381.7524 34
Clinton, NY 13323 USA
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