Indium Corporation Technology Expert to Present at IMAPS International Conference on Device Packaging |
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Indium Corporation
34 Robinson Rd.
Clinton, NY, 13323
USA
Press release date: March 2, 2012
Indium Corporation's Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6 - 8, 2012 in Scottsdale/Fountain Hills, Arizona.
Robert's presentation, Global Supply Chain Sourcing for Minor Metals for High Volume Manufacturing for Electronics: Risks and Opportunities, details Indium Corporation's research that shows there is an ample supply of indium and gallium metals and that there is considerable potential for improving global supply in the long term. Robert will also discuss the common myths that are prevalent today regarding the availability of indium and gallium and share data to show historic supply and demand. He will present details on the supply chains and recycling loops that currently exist.
Robert is the Product Manager for Metal Compounds and also Manager of Marketing and Technology Assessment for Indium Corporation. He provides customer support to a variety of high-tech industries that consume indium, gallium, germanium, and tin compounds.
Robert earned a doctorate in physics from the University of Regensburg in Germany and an MBA from the S.C. Johnson Graduate School of Management at Cornell University.
For more information about the conference, visit www.imaps.org/devicepackaging.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoilŪ. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
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