Indium Corporation Technical Papers Accepted for APEX Technical Conference
Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29-April 5, 2009.
Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
o Thursday, April 2, 10:15am - 11:45am
Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
o Tuesday, March 31, 1:30pm - 3:00pm
Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris's paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
o Wednesday, April 1, 1:30pm - 3:00pm
Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.
Tim Jensen has a bachelor's degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.
Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor's degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College's Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, www.indium.com/blogs/Mario-Scalzo-Blog/.
Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing. He has a master's degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
For more information about the technical conferences and APEX, visit www.goipcshows.org
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Contact:
Anita Brown, Marketing Communications Manager
Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Utica, NY 13502
www.indium.com
