Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS
34 Robinson Rd.
Clinton, NY, 13323
Press release date: August 21, 2014
Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.
LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput yields, and component performance. LV1000 is halide-free, meets the ROL0 requirement without sacrificing strength, and passes Telecordia GR-78 requirements in the both the activated and unactive state.
LV1000 provides a durable, level, clear coating that does not clog pick-and-place equipment, even in automated assembly processes. It offers complete coverage, even with a weight percentage as low as 0.5 percent.
Flux coatings provide consistent, uniform amounts of flux every time, with excellent control over the flux volume/weight percentage. Indium Corporation’s flux-coated solder performs come in a variety of packaging and can be color coded. The company’s flux coatings are applied to the outside of the preform where the flux is required, rather than in the core.
Indium Corporation will be exhibiting at booth 217.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoilŪ. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com.
34 Robinson Road
Clinton, NY 13323 USA