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Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM

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Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM
Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM
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Indium Corporation
34 Robinson Rd.
Clinton, NY, 13323
USA



Press release date: April 23, 2014

Indium Corporation will feature its Heat-SpringŪ Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany.

Heat-SpringŪ is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-SpringsŪ offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-SpringsŪ do not experience pump-out even under repeated power cycling.

Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.

For more information about Heat-SpringŪ thermal interface materials, visit www.indium.com/heat-spring, or stop by to talk to any of Indium Corporation’s technical experts at PCIM, stand 7-454.

Contact:
Victoria Cruz-Griffith, Marcom Specialist
Indium Corporation
vcruz-griffith@indium.com
tel: +1.315.381.2052
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com
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