Products in the News

Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM

Share Like Tweet Add Email

Indium Corporation

34 Robinson Rd., Clinton, NY, 13323, USA

Original Press Release

Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM

Press release date: April 23, 2014

Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany.

Heat-Spring® is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under repeated power cycling.

Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.

For more information about Heat-Spring® thermal interface materials, visit www.indium.com/heat-spring, or stop by to talk to any of Indium Corporation’s technical experts at PCIM, stand 7-454.

Contact:
Victoria Cruz-Griffith, Marcom Specialist
Indium Corporation
vcruz-griffith@indium.com
tel: +1.315.381.2052
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com

Share Like Tweet Add Email

LIKE THIS ARTICLE? DON’T MISS OUT ON OTHERS! Get Thomasnet’s industry newsletter now

Comments

comments powered by Disqus