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Implementing Lead-Free Soldering with Cost Reduction and Reliability

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Implementing Lead-Free Soldering with Cost Reduction and Reliability
Implementing Lead-Free Soldering with Cost Reduction and Reliability
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(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Nihon Superior Co. Ltd
NS Bldg., 1-16-15 Esaka-Cho
Suita City, Japan

Press release date: May 1, 2012

Nihon Superior to Offer Voiding Reduction and Aluminum Soldering at Jisso Protec 2012

OSAKA, JAPAN - Nihon Superior Co., Ltd., a supplier of advanced soldering materials to the global market, announces that it will showcase a new, expanded range of products at Jisso Protec 2012, which will be held at the Tokyo Big Sight from June 13-15, 2012. These products are based on the company's well-known silver-free and lead-free solder SN100CŪ, which now has a track record of more than 13 years of successfully delivering high productivity and high reliability.

The company will debut its new lead-free solder paste SN100C P810 D4, which reduces the incidence of voids in large-area solder joints between power semiconductors and their substrates. Also being introduced is solder-coated aluminum ribbon for tabbing of solar cells to take advantage of aluminum's lower cost and lower density than copper. Additional featured products include the SN100C Advantage series SN99CN with an Ag addition and completely halogen-free solder paste, flux-cored solder wire and liquid flux. New developments from Nihon Superior are Sn-Zn solder paste LF-Z3 PF-14 D3 and SN100C7A high melting point lead-free solder for power modules.

Voiding Reduction:
Voiding Reduction
Lead-Free Solder Paste
SN100C P810 D4 NEW

Second-Generation Completely Halogen-Free
  • SN100C P602 D4 Solder Paste
  • SN100C P603 D4 & P605 D6, Dispensing Grade
  • SN100C(044) High Activity Flux-Cored Solder Wire
  • NS-F900 Soldering Flux

    SN100C Advantage Series(TM) Low silver
  • Lead-Free Solder Sphere SN99CN and Paste SN99CN P502 D4

    High-Reliability Lead-Free Solder SN100CŪ,
  • Paste: General Purpose SN100C P500 D4 or 01005(0402 metric) Chip Components SN100C P520 D5 for Power Semiconductor SN100C P800 D2
  • Sphere: High Impact Strength SN100C
  • Flux-Cored Solder Wire: High-Performance SN100C(551CT), Ultra-Fine Flux-Cored Solder Wire
  • Solder Preforms
  • Flux: NS-F850

    New Development
  • Completely Halogen-Free Sn-Zn solder paste LF-Z3 PF-14 D3
  • SN100C7A high melting point lead-free solder for power modules

    About Nihon Superior Co., Ltd.
    Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

    Nihon Superior Co., Ltd.
    Overseas Sales Section
    NS Bldg., 1-16-15 Esaka-Cho
    Suita City, Osaka,
    564-0063 Japan
    Tel: +81-(0)6-6380-1121
    Fax: +81-(0)6-6380-1262
    Web site:

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