ISSYS / NanoGetters to Deliver Talk on MEMS Vacuum Packaging at COMS 2011
YPSILANTI, MI--(August 9, 2011) - Integrated Sensing Systems, Inc. (ISSYS) announced that its Executive Vice President, Doug Sparks will present a paper on MEMS vacuum packaging from a product and foundry perspective on August 31st, 2011 at COMS 2011. See: www.cvent.com/events/coms-2011/event-summary-735e4195319b4b4580c97951ed874284.aspx .
Many MEMS devices require vacuum packaging for improved performance and reliability. MEMS-based gyroscopes, accelerometers, pressure sensors, RF-resonators IR-sensors and displays and fuel quality sensors all use vacuum packaging. Both package-level and wafer level vacuum sealing will be covered in this talk. Thin-film getters, like NanoGetters are a relatively new development that has been applied to this field both at the chip and ceramic or metal package level. The use of various wafer bonding and packaging methods will be include in the talk with respect to internal product development and obtaining this technology as a part of a MEMS foundry service.
NanoGetters services more than 40 customers in the MEMS vacuum packaging industry and is a wholly owned affiliate of ISSYS.
Company Background
ISSYS is a leader in advanced MEMS technologies for industrial, medical devices, microfluidic and scientific analytical sensing applications. Founded in 1995 ISSYS is one of the oldest independent MEMS companies in the US. ISSYS operates a "full manufacturing under one roof," multi-million-dollar, state-of-the-art MEMS fabrication facility located near Ann Arbor, Michigan. With ISO 9001:2008 and ISO 13980 certification, and a quality system designed to meet ISO 13485:2003 (medical device manufacturing), ISSYS is a vertically integrated company dedicated to developing and manufacturing system-level products based on MEMS technology (MEMS Inside), please visit:: hhtp://www.mems-issys.com and www.nanogetters.com for more information on NanoGetters services.
