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IPC releases Japanese version of IPC-A-610E.

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April 4, 2012 - IPC announced Japanese language release of E revision of IPC-A-610, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements. E revision address additional technologies, including flexible circuits, board in board, package on package, depanelization, and additional SMT terminations. Also, revision contains 165 new or updated illustrations, bringing total to more than 800.

IPC-A-610E Japanese Language Released: Industry Requirements for Acceptability of Electronic Assemblies Updated


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: April 3, 2012

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC's most widely-used standard. This document provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements. The E revision of IPC-A-610 addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.

The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A-610, have also been upgraded. The E revision contains 165 new or updated illustrations, bringing the total to more than 800.

In addition, the standard has been revamped for ease of use and clarity. Sections have been reorganized so data and images are easier to find and to make it easier to use. Zenaida Valianu, training and development specialist at Celestica agrees, "The document is more intuitive and manageable than before, allowing users to navigate more easily and locate information promptly."

The many changes that have occurred in array packaging since the standard's last revision are also addressed in the E revision, as are changes to hot tear and filet lifting.

Designers and manufacturers will appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular to the assembly using a through-the-board method.

"IPC is grateful to Celestica Japan KK for its assistance in translating this important document into Japanese," says Jack Crawford, IPC director of certification.

For more information or to purchase IPC-A-610E-JP, 電子組立品の許容基準, or any of the other fourteen languages for this standard, visit www.ipc.org/610. The hard copy price for IPC members is $55 (U.S.) and the standard price is $110 (U.S.). Additional formats of IPC-A-610E-JP are available. IPC-A-610E-JP can also be purchased by contacting IPC's official distributor in Japan - Filmex Corporation, at filmex@corp.email.ne.jp or +81 463 73 4620.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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