IPC launches poster competition for IPC APEX EXPO(TM).

Press Release Summary:



IPC is inviting U.S. and international colleges/universities to submit poster abstracts for 2nd-annual all academic poster competition at IPC APEX EXPO(TM) from April 6-8, 2010. Abstracts must be previously unpublished, noncommercial work covering industry case histories, research, and discoveries in 100-300 words and be received by January 15, 2010. Following technical committee review and online voting, authors of top 10 will display work at show, where top 3 will receive monetary prizes.



Original Press Release:



IPC Sponsors All Academic Poster Competition



BANNOCKBURN, Ill, USA, September 15, 2009 - IPC - Association Connecting Electronics Industries® invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit poster abstracts for the "all academic poster competition" at IPC APEX EXPO(TM), the industry's premier conference on electronics manufacturing, April 6-8, 2010, in Las Vegas. In its second year, this competition presents academic research departments with an exceptional opportunity to gain international visibility and recognition of their research as well as their academic institution. In addition, the IPC All Academic Poster Competition will provide cash awards to the top three research posters.

Submissions for posters are sought on design, materials, processes and equipment in the areas or related areas of:

o Design

o Embedded Passive & Active Devices

o Flexible Circuitry

o High Frequency

o Lead-Free Issues

o Printed Board Fabrication

o Rework & Repair

o RFID Circuitry

o SMT Assembly

o Test & Inspection

o Printed Electronics

o Package on Package Assembly

o Solar Cell Assembly

Abstracts of 100 to 300 words that summarize technical and previously unpublished, noncommercial work covering case histories, research and discoveries must be submitted on behalf of an accredited college or university, and must be received by January 15, 2010.

Following a technical committee review, all passing poster abstracts will be posted on the IPC APEX EXPO show Web site. Industry technologists worldwide will be invited to vote online for the best poster abstract based on innovation, timeliness of the work and applicability to industry needs. Authors of the 10 posters receiving the most votes will be invited to Las Vegas to display their posters on the show floor April 6-8, 2010.

As invited guests, the winning authors will receive an airfare allowance to attend the show and IPC will provide free hotel accommodations for four nights (one room per poster) and a free technical conference registration.

During the show, exhibition attendees and exhibitors will vote for the best poster. The top three posters will be announced at the close of the show floor reception on Wednesday, April 7 and cash awards of $3,000, $1,000 and $500, for first, second and third places, respectively, will be presented to the winning poster authors.

Notably, the "all academic poster competition" at IPC APEX EXPO offers a great opportunity for close interaction and communication between academic research programs and companies in electronics assembly and printed board manufacturing and design.

For complete details, visit IPCAPEXEXPO.org/AcademicPosters. Questions may be directed to Greg Munie, conference director at GregMunie@ipc.org or Toya Richardson, IPC technical administrative assistant, at ToyaRichardson@ipc.org or +1 847-597-2825.

About IPC

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

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