IPC issues call for abstracts/proposals for 2010 exposition.May 20, 2009 -
IPC is inviting researchers, academics, technical experts, and industry leaders to submit abstracts for 2010 IPC APEX EXPO in Las Vegas on April 6-9, 2010. Participants must submit 300-word abstract summarizing original and unpublished work covering case histories, research, and discoveries by July 17, 2009. Proposals are also solicited for full- and half-day professional development courses on design, printed board, and electronic manufacturing processes/materials.
IPC Issues Call for Participation for 2010 IPC APEX EXPO
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: May 19, 2009
BANNOCKBURN, Ill., USA, May 19, 2009 - IPC - Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay Resort and Convention Center, Las Vegas, April 6-9, 2010.
IPC APEX EXPO is the world's premier conference and exhibition for the electronic interconnect industry - developed and presented by the industry for the industry - and provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives worldwide. To recognize exceptional achievement, awards will be presented for "Best U.S. Paper" for U.S. authors and the "Best International Paper" for authors from outside the United States.
Expert presentations are being sought on all relevant electronics' design, PCB fabrication and manufacturing topics. Submissions in the areas of package on package assembly, printable electronics and advanced substrates are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by July 17, 2009. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of the technical and/or appropriate test results in the final paper.
Proposals are also solicited for full-day and half-day professional development courses on design, printed board and electronic manufacturing processes and materials.
All abstracts and proposals are due July 17, 2009. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/call-for-papers. For more information about conference presentations, contact Toya Richardson, IPC technical administrative assistant, at ToyaRichardson@ipc.org or +1 847- 597-2825. For course proposal information, contact Anne Marie Mulvihill, IPC professional development program manager at AnneMarieMulvihill@ipc.org or +1 847-597-2827.
IPC (http://www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.