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IPC issues call for IPC Midwest Conference participation.

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February 24, 2009 - Scheduled for Sept 23-24, 2009, IPC Midwest Conference and Exhibition will focus on quality and reliability of PCBs and assemblies. Technical experts are invited to present paper or teach professional development course in areas of board compliance, assembly technology, quality/test/reliability, and eco-compliance. In addition to case histories and field data, abstracts should summarize problems and resolutions, methods used, results of experiments, and benefits to industry.

IPC Issues Call For Participation For IPC Midwest Conference & Exhibition

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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015

Press release date: February 18, 2009

Conference to Focus on Quality and Reliability

BANNOCKBURN, Ill., USA, February 18, 2009 - IPC - Association Connecting Electronics Industries® has issued a Call for Participation for the Midwest's premier technical conference, IPC Midwest Conference & Exhibition. This exhibition will take place September 23-24, 2009. The conference will be held on September 23 and professional development courses will take place on September 24. All events will be held at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Ill.

Technical experts are invited to present a paper or teach a professional development course at this unique event. "This year's conference will focus on the quality and reliability of printed circuit boards (PCBs) and assemblies," says IPC Conference Director Dr. Greg Munie. "In these tough economic times, these issues can have an immediate impact on a company's profitability. We are going to put together a conference that will offer companies tangible information in these critical areas."

Technical presentations and/or papers are being sought in the areas of board compliance: advances in plating technology, advances in flex and rigid-flex, via formation and fill; assembly technology: rework and repair, lead-free assembly, backward leaded/lead-free compatibility; quality/test/reliability: solder joint reliability, electrical test, X-ray/AOI; and eco-compliance: REACH, halogen-free technology, and lead free.

Abstracts must be submitted by April 14, 2009 and should include detailed case histories, field data, new technologies or innovations or research and findings. In addition, abstracts should summarize the problems and resolutions, methods used, results of experiments and benefits to the industry.

Proposals are also being solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) professional development courses on design, printed circuit board and electronic manufacturing processes and materials. Proposals including course descriptions must be submitted by April 14, 2009.

For additional information on technical presentation/paper abstracts or professional development course proposals, including online submittals, visit Contact either Greg Munie at for questions on technical conference abstracts or the IPC Professional Development Coordinator at for questions on professional development courses.

About IPC
IPC ( is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.
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