IPC awards volunteers for industry contributions.
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Press Release Summary:
At IPC Midwest Conference and Exhibition 2009, held September 20-24 in Schaumburg, IL, IPC presented Special Recognition, Distinguished Committee Leadership, and Distinguished Committee Service awards. Total of 58 awards were presented to individuals who have made significant contributions to IPC and electronics industry by lending time and expertise to committees, standards, and program development.
Original Press Release:
Volunteers Honored for Their Contributions to IPC and Industry
Fifty-Eight Awards Presented at IPC Midwest
BANNOCKBURN, Ill., USA, September 22, 2009 - IPC - Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC Midwest Conference & Exhibition 2009, held September 20-24 in Schaumburg, Ill.
The awards were presented to individuals who have made significant contributions to IPC and the electronics industry by lending their time and expertise to committees and standards and program development.
Special Recognition award recipients were:
o Marg Drouin, Cirtronics Corporation, for her contributions to IPC Multimedia Training in providing materials, acting as technical advisor, and input and review of scripts.
o Mike Freda, Sun Microsystems Inc., for his contributions to the IPC Executive Market and Technology Forum as a steering committee member and speaker.
o Mike Bryant, BGF Industries, Inc. and Silvio Bertling, Neltec, Inc., for their contributions to the development of a data-based value of permittivity/dielectric constant for E-glass in IPC-4412A, Specification for Finished Fabric Woven from "E" Glass for Printed Boards.
o Kathy Johnston, Raytheon Missile Systems, for her extraordinary contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
o Daniel Foster, Defense Acquisition Inc., for his training committee leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
o Jeannette Plante, NASA Goddard Space Flight Center, for her leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
Distinguished Committee Leadership awards went to:
o Antonio Senese, Panasonic Electric Works and Douglas Sober, Kaneka Texas Corporation for their leadership of the 3-11 Laminate/Prepreg Materials Subcommittee that developed IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards.
o George Milad, Uyemura International Corp. and Gerard O'Brien, Solderability Testing & Solutions, Inc., for their leadership of the 4-14 Plating Processes Subcommittee that helped develop IPC-4553A, Specification for Immersion Silver Plating for Printed Boards.
o Michael Jouppi, Lockheed Martin, for leadership of the 1-10b Current Carrying Capacity Task Group that developed IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.
o Hue Green, Lockheed Martin Space Systems Company and Garry McGuire, NASA Marshall Space Flight Center, for leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
Distinguished Committee Service awards were presented to:
o Michael Beauchesne, Amphenol Printed Circuits Inc.; Silvio Bertling, Neltec, Inc.; Tracy Cai, Guangdong Shengyi Sci. Tech Co. Ltd.; Terry Fischer, Hitachi Chemical Co. America, Ltd.; Robert Hearn, Dow Chemical USA; Douglas Leys, Nelco Products, Inc.; Rolland Savage, High Performance Copper Foil Inc.; Crystal Vanderpan, Underwriters Laboratories Inc.; Daniel Welch, Arlon MED; Dewey Whittaker, Honeywell Inc. Air Transport Systems and Karl Sauter, Sun Microsystems Inc., for their contributions to IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards.
o Dr. Martin Bayes, Dow Electronic Materials; Elizabeth Benedetto, Hewlett-Packard Company; Trevor Bowers, Adtran Inc.; Donald Gudeczauskas, Uyemura International Corp.; David Hillman, Rockwell Collins; Helen Holder, Hewlett-Packard Company; James Kenny, Enthone Inc. - Cookson Electronics; Karl Sauter, Sun Microsystems Inc.; Dr. Polina Snugovsky, Celestica Canada and Karl Wengeroth, Enthone Inc. - Cookson Electronics, for their contributions to IPC-4553A, Specification for Immersion Silver Plating for Printed Boards.
o Byron Case, L-3 Communications; Don Dupriest, Lockheed Martin Missiles and Fire Control; Gary Ferrari, FTG Circuits; Michael Green, Lockheed Martin Space Systems Company; Michael Miller, NSWC Crane; Jack Olson, Caterpillar Inc.; William Ortloff, Raytheon Company and Dewey Whittaker, Honeywell Inc. Air Transport Systems, for their contributions to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.
o James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Michael Engler, The Aerospace Corporation; Charles Gamble, NASA Marshall Space Flight Center; Ronald Hebden, NASA Goddard Space Flight Center; Robert Humphrey, NASA Goddard Space Flight Center; Lisa Maciolek, Raytheon Company; Norma Moss, L-3 Communications; David Nelson, Raytheon Company; William Ortloff, Raytheon Company; Doug Rogers, Harris Corporation, GCSD; Richard Rumas, Honeywell Canada; Blen Talbot, L-3 Communications; Anthony Wong, NASA Johnson Space Center and Alan Young, Jet Propulsion Laboratory, for their contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
For more information on these awards and the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.
