IPC awards Jack Bramel with highest level of recognition.April 21, 2010 -
At IPC APEX EXPO(TM) in Las Vegas, Jack Bramel was presented with 2009 IPC Raymond E. Pritchard Hall of Fame Award, IPC's highest level of member recognition. Involved in IPC for more than 40 years, Bramel co-chaired committee that released first IPC PCB process standard in 1974. For more than 10 years, Bramel chaired open forum for PCB processes at IPC meetings. He also chaired IPC task group that works with UL and CSA, and is lifetime member of the Technical Activities Executive Committee.
Jack Bramel Receives IPC Raymond E. Pritchard Hall of Fame Award
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: April 9, 2010
BANNOCKBURN, Ill., USA - In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Jack Bramel, Jack Bramel & Associates was awarded the 2009 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO(TM) in Las Vegas, the Hall of Fame Award represents IPC's highest level of member recognition.
An industry pioneer, Bramel has been involved in IPC for more than 40 years. He first became involved with standards as an engineer for Magnavox where he actively worked on improving military specifications for boards and materials. He co-chaired the committee that released the first IPC printed board process standard in 1974. Bramel chaired the open forum for printed board processes at IPC meetings for more than 10 years. As a result of those forums, new IPC committees on drilling, solder mask and other printed boards subjects were formed. He also served as chairman of the process effects committee for 14 years, from 1974 through 1989, helped develop technical programs for IPC meetings and served as a frequent panel discussion leader.
Bramel has chaired the IPC task group that works with Underwriters Laboratories Inc. (UL) and Canadian Standards Association (CSA) since 1975 and continues to serve on both the industry advisory group and standards technical panel for copper clad laminates and PCBs. As a part of these activities, he took a leadership role in providing industry input to UL on the following: polymide generic grade test program; laminate fingerprint identification program on FR-4; UL HDI recognition program; and silver finishes program.
He is a lifetime member of the Technical Activities Executive Committee. In recognition of his contributions to IPC, Bramel received the IPC President's Award in 1976.
Commenting on his achievements, Bramel reflects, "IPC participation has been great for my career. I've met some great people and I've had a lot of fun. The network I met through IPC meant I never had to interview for a job. I've seen it all from single-sided boards through HDI and I've had a lot of fun along the way. It's been absolutely rewarding and I wouldn't change a single thing."
For more information on the IPC Hall of Fame and other awards presented at IPC APEX EXPO, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.