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IPC announces 2009 Academic Poster Competition winners.

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April 28, 2009 - Evaluated on innovation and originality, posters were voted upon by IPC APEX EXPO attendees. Jianbiao Pan of California Polytechnic State University won 1st place for "The Calculation of Liquidus Temperature for Various BGA/CSP Assemblies." John Folkerts and Frank Collins from Johns Hopkins University took 2nd place with "Printed Wiring Board Delamination - Some Unique Findings." Tied for 3rd were Aaron Pedigo, Pylin Sarobol, John Blendell, Carol Handwerker, and John P. Koppes from Purdue.

IPC APEX EXPO Attendees Select 2009 Academic Poster Competition Winners


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: April 23, 2009

BANNOCKBURN, Ill., USA, April 23, 2009 - Offering a glimpse into the bright future of the electronic interconnection industry, IPC - Association Connecting Electronics Industries® has announced the winners of the first IPC Academic Poster Competition at IPC APEX EXPO, held March 31-April 2, 2009 in Las Vegas. Evaluated on innovation and originality, the posters were voted upon by the event's attendees.

Top three honors went to: California Polytechnic State University, winning first place for "The Calculation of Liquidus Temperature for Various BGA/CSP Assemblies," authored by Jianbiao (John) Pan. John Folkerts and Frank Collins from Johns Hopkins University took second place with "Printed Wiring Board Delamination - Some Unique Findings." Tied for third place were Aaron Pedigo, Pylin Sarobol, John Blendell and Carol Handwerker of Purdue University for "Whisker and Hillock Growth Observed on Pure Sn, Sn-CU, and Sn-Cu-Pb Electroplated Films," and John P. Koppes, also from Purdue, for "Utilizing the Thermodynamic Nanoparticle Size Effects for Low Temperature Pb-Free Solder Applications."

IPC launched the academic competition to foster greater accessibility to academic research and strengthen the relationship between academia and the industry. "It was both a pleasure and honor to be selected to compete in IPC's first academic poster competition," said Folkerts (Hopkins). "In today's economic climate it is even more relevant to engage universities and colleges in the exciting and rewarding field of printed board fabrication and assembly." Pedigo (Purdue) agrees, "From a student's point of view, IPC APEX EXPO was an excellent opportunity to learn about industrial practices, to share our research and show how it is industrially significant." Collins (Hopkins) also concurred, "As a participant, I was very impressed with the attendees' interest and turnout for the academic posters, along with IPC's support." More than 30 abstracts were submitted from universities around the world. Cash prizes were awarded to the first, second and third place poster winners. "We were very pleased with the quality and the enthusiasm of the competitors this first year, and look forward to even more academic participation next year," said Greg Munie, IPC conference director.

The next IPC Academic Poster Competition will take place April 6-8, 2010 at IPC APEX EXPO. For information about participation, contact Munie at GregMunie@ipc.org.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.
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