IPC and WHMA revise cable and wire harness standard.
Press Release Summary:
November 16, 2012 - A joint effort of IPC and the Wire Harness Manufacturer's Association, B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies addresses more than 500 documented comments and recommendations from users throughout the industry, with 125 new or changed illustrations. Document offers expanded molding and potting section for increased coverage of Class 2 and 3 requirements, new criteria for wires as small as 32 AWG, and section on requirements flow down.
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive, Bannockburn, IL, 60015, USA
Original Press Release
New Revision of IPC/WHMA-A-620 Released
Press release date: October 31, 2012
Hundreds of Enhancements Made to Cable and Wire Harness Assemblies Standard
BANNOCKBURN, Ill., USA, — Significant technical updates, greater ease-of-use and compatibility with other key assembly standards are among the many changes users will find in the newly released B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
The revision addresses more than 500 documented comments and recommendations from users throughout the industry and features 125 new or changed illustrations.
“There have been major enhancements in nearly every chapter, with updated and expanded criteria,” said Jack Crawford, IPC’s director of certification and assembly technology.
Some of the most extensive changes appear in the molding and potting section, which has been expanded for increased coverage of Class 2 and 3 requirements, including 31 new illustrations. The document also provides new criteria for wires as small as 32 AWG, and has a section on requirements flow down, which requires companies to have their subcontractors use the standard to ensure all hardware is manufactured to the same guidelines.
In addition, the revised document allows users to more easily reference and apply criteria from multiple standards, thanks to greater compatibility with the widely used J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610E, Acceptability of Electronic Assemblies.
Users with varying reliability requirements and markets in different regions will also have greater ease-of-use with the addition of UL, SAE and IEC pull-force tables.
“Depending on their customers’ needs, users can look at different sections and know they’re meeting industry or regional requirements,” said T. John Laser, a manufacturing engineer at L-3 Communications and chair of the IPC task group that developed the standard.
IPC/WHMA-A-620B is 400 pages long and features 682 full-color illustrations. IPC members may request one free single-user download or hard copy of IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies, at www.ipc.org/A-620B-request within 90 days of the document’s publication. After that date, IPC members may purchase the standard for $55. The industry price is $110. For more information or to purchase a copy of IPC/WHMA-A-620B, visit www.ipc.org/620.
The IPC/WHMA-A-620 Technical Training Task Group is currently updating the IPC-A-620 training and certification program; roll-out is expected by March 2013.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.