IPC and Raytheon Partner Together to advance HDI technology.
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Press Release Summary:
To help companies gain most from HDI (high density interconnect) technology, Raytheon is sponsoring "IPC HDI Conference: Advancements in Materials, Processes and Applications." Event will take place October 24-25 in Los Angeles, CA and feature Peter Gould's keynote, "The Raytheon HDI Roadmap," as well as other speakers presenting on HDI-related topics. In addition to two 3 hr workshops, conference will offer tabletop exhibits that let attendees talk with HDI technology suppliers.
Original Press Release:
IPC and Raytheon Join Forces to Advance HDI Technology
IPC Conference to Highlight the Subtleties and Benefits of HDI
BANNOCKBURN, Ill., USA - Not your average hole in the board, high density interconnect (HDI) technology allows PCB manufacturers to produce smaller, more efficient boards, but its huge performance benefits wane significantly if its subtle differences from conventional through hole technology are not fully understood. To help companies gain the most out of HDI technology, Raytheon is sponsoring the "IPC HDI Conference: Advancements in Materials, Processes and Applications," October 24-25 in Los Angeles, Calif.
"If you tackle these boards like conventional multilayer boards, you'll lose half the benefits," says Happy Holden, director of electronics at Gentex Corp. "People treat HDI and microvias as just another hole in the board, but they need to look at the nuances of small holes." Holden is one of 14 subject-matter experts who, over the two-day event, will present on the latest advancements in HDI technology.
To kick off the conference portion of the two-day event, Peter Gould, space and airborne systems vice president for engineering, Raytheon, will present the keynote address, "The Raytheon HDI Roadmap" on October 25. Other morning speakers include: Holden on HDI use in optical waveguides; Jamin Taylor and Chan Sam of Minco Products discussing via reliability in flexible circuit HDI applications; Mike Carano, OMG Electronic Chemicals, presenting on key chemical process considerations; and Mike Palazzola, Atotech USA, with a systematic investigation on complete through hole filling by a Cu electroplating process.
The afternoon programs and topics include: Susy Webb, CID, FairfieldNodal, with insights into what a type I or II HDI stackup can give; Vern Solberg, Invensas, on molded Cu wire contact solution for very high density package-on-package applications; Jim Fuller, Endicott Interconnect Technologies, discussing evolving HDI beyond microvias; Raj Kumar, ViaSystems Group, explaining advances in HDI technology; Michael Gay, Isola Group, on advances in substrates; and to close the conference, an HDI market update presented by Sharon Starr, IPC.
Two, three-hour workshops will be held prior to the conference on October 24 for design and manufacturing engineers who want to explore HDI at a deeper level. Holden will serve as the instructor for the workshop on advanced HDI design strategies and Tom Buck, Viasystems Group, will provide instruction on integrating advanced microvia structures in complex circuits.
In addition to the workshops and conference, the event will feature tabletop exhibits, allowing attendees to talk with leading suppliers of HDI technology.
For more information on attending the conference or workshops, visit http://www.ipc.org/HDI-conference.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
