IPC and JEDEC announce international conference.October 21, 2008 -
Scheduled for Dec 8-10, International Conference on Lead-Free Electronics will feature full-day technical conference covering topics such as RoHS challenges on electronic assembly and material, transitioning server motherboards to lead-free, and lead-free solder joint reliability. Half-day workshops will address topics such as lead-free solder process, data management for eco-compliance, lead-free compliance, and understanding failure and root-cause analysis in lead-free electronics.
IPC and JEDEC Announce International Conference Offering Solutions to Challenges
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: October 20, 2008
Posed by Lead-Free Electronics Manufacturing
Bannockburn, Ill. and Arlington, Va., October 20, 2008 - IPC - Association Connecting Electronics Industries® and JEDEC Solid State Technology Association today announce an International Conference on Lead-Free Electronics. To be held December 8-10, 2008 at the Fairmont Hotel in Dallas, Texas, the event will feature a full-day technical conference with an outstanding roster of speakers, as well as two full days of informative half-day workshops.
"The electronics industry is in the midst of one of the largest changes that has occurred over the last 50 years. The migration to lead-free materials has resulted in a significant shift in the way the industry perceives reliability. It is critical for engineers and technical managers to stay informed of latest developments with respect to performance of lead-free assemblies," said David Torp, IPC vice president of standards and technology.
Added John Kelly, president of JEDEC, "This joint conference hosted by IPC and JEDEC provides the most comprehensive and up-to-date compendium of information presented on this topic. As member-driven organizations, we believe it's imperative to give the industry as many opportunities as possible to share real-world information on how companies are meeting these challenges every day."
The technical conference program features speakers from many well-known companies, including Alcatel-Lucent, Dell, Emerson and Texas Instruments. Selected topics include:
o RoHS Challenges on Electronic Assembly and Material
o Transitioning Server Motherboards to Lead-Free
o Characterization of the Thermal Stability of Electrical Laminates for Lead-Free Soldering
o XRF Verification of Component Terminations
o RoHS Compliant Components in a Non-RoHS Process
o Lead-Free Solder Joint Reliability
o PLM Solutions to Accelerate Lead-Free Electronics Designs
o A Component Supplier's Green Approach
Those searching for information on reliability will find it covered from many angles in the half-day courses. Courses include:
o Lead-Free Solder Process - Survival, Quality, and Reliability: The Problems
o Lead-Free Solder Process - Survival, Quality, and Reliability: The Solutions
o Final Finishes and their Compatibility with Lead-Free Soldering
o Data Management for Eco-Compliance
o Lead-Free Reliability for Harsh Environment Electronics
o Understanding Failure and Root-Cause Analysis in Lead-Free Electronics
o Lead-Free Components
o Understanding of J-STD-020 and J-STD-033 - The impact of PB-Free on Classification and Handling of Moisture-Sensitive ICs
Top suppliers will also be showcasing new products and services. For more information about reserving tabletop exhibit space, contact Tina Nerad at +1 847-597-2826 or at TinaNerad@ipc.org .
Visit ipc.org/LF1208 to learn more about the conference and to register online. Early bird registration discounts are available until November 5, 2008.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
JEDEC is the leading developer of standards for the solid-state industry. Almost 3,300 participants, appointed by some 295 companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.