ThomasNet News Logo
Sign Up | Log In | ThomasNet Home | Promote Your Business

IPC Technical Conference to focus on innovation.

Print | 
Email |  Comment   Share  
February 12, 2009 - IPC APEX EXPO(TM) will take place at Mandalay Bay Resort and Convention Center in Las Vegas from March 31 - April 2, 2009. It will include 35 sessions with nearly 100 papers to present leading industry research and findings. Presenting at the technical conference will be Christopher Hunt and Davide Di Maio from UK, Gerjan Diepstraten and Dr. Di Wu from Netherlands, Gregory Morose, Joe Smetana, Jennifer Nguyen, Michael H. Azarian, and Lei Nie.

IPC Apex EXPO Technical Conference Inspires Next Generation of Innovation


(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: February 10, 2009

BANNOCKBURN, Ill., USA, February 10, 2009 - Advancements in technology and a relentless drive to realize imagination - these things don't cease to exist because of an economic downturn. As witnessed by the IPC program committee that selected the technical papers, they are alive and well - the best of which will be introduced at IPC APEX EXPO, March 31-April 2, 2009, at the Mandalay Bay Resort & Convention Center, in Las Vegas. In total, 35 sessions with nearly 100 papers will present the industry's leading research and findings to stimulate new thinking and inspire the next generation of innovation.

"The opportunities these papers reveal are extraordinary," said Greg Munie, Ph.D., conference director, IPC APEX EXPO Technical Program Committee. "In light of the times, I can't help but think of one of my favorite quotes, 'If you think education is expensive, try ignorance.' Of all the industry meetings in 2009, APEX EXPO is not the one to miss if you are looking for the best education from around the world, all in one place."

Technical conference highlights include:
o From the UK, Christopher Hunt and Davide Di Maio, from National Physical Laboratory will present, A Test Methodology for Copper Dissolution in Lead-Free Alloys, a study of the effect of lead-free alloys on the copper metallization of printed circuit boards.
o From the Netherlands, Gerjan Diepstraten and Dr. Di Wu, Cobar Europe B.V., will discuss their study predicting the processability of solder pastes based on their performance under heating in Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis.
o Representatives from IBM Corporation and Celestica International Inc. in Canada will join forces to present, Rework Process Window and Microstructural Analysis for Lead-Free Mirrored BGA Design Points, discussing the reliability impact on components when a component on the opposite side of the board is reworked.
o From the U.S., Gregory Morose from the University of Massachusetts will present new findings to the question, "Are halogen and lead-free assemblies as reliable as the old tin-lead processed boards?" in, Long Term Reliability Analysis of Lead-Free and Halogen-Free Electronic Assemblies.
o Joe Smetana, of Alcatel-Lucent, will discuss how higher temperatures of lead-free assembly affect the performance of the printed board in, Bare Board Material Performance after Pb-Free Reflow.
o Given that lead-free solders are notorious for dissolving copper, Jennifer Nguyen, Flextronics, will talk about the steps that can be taken in printed board fabrication to reduce that danger in The Effect of Copper Plating Processes and Chemistries on Copper Dissolution.
o An overlooked aspect of lead-free solders is the difference they show in electromigration when compared to tin-lead solder. Michael H. Azarian, with the Center for Advanced Life Cycle Engineering (CALCE), will present, Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders, covering the level of liability associated with electromigration by lead-free alloys.
o In re-work, the danger of dissolving copper is magnified. Lei Nie, CALCE, will examine that danger and propose solutions to mitigate the problem in Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies.

For more information on the IPC APEX EXPO Technical Conference, including full descriptions of all 35 sessions and their respective papers, visit the Show's Web site, www.IPCAPEXEXPO.org.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.



Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
 See more product news in:
Services
 More New Product News from this company:
Scientific RoHS Revision Decision was praised by IPC.
More ....
| Featured Manufacturing Jobs
 Other News from this company:
IPC Releases IPC-1755, Conflict Minerals Data Exchange Standard
Six Industry Volunteers Receive IPC President's Award
IPC Crowns Winner of Hand Soldering World Championship
IPC and ITI to Host Seminars on Critical and Emerging Product Environmental Requirements
Volunteers Honored for Contributions to Electronics Industry and IPC
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-mail this story to a friend
Save Story
Search for suppliers of
Trade Associations


Home  |  My ThomasNet News®  |  Industry Market Trends®  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2014 Thomas Publishing Company. All Rights Reserved.
Terms of Use - Privacy Policy



Error close

Please enter a valid email address