IPC to hold conference showcasing pcb design technologies.
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Press Release Summary:
IPC - Association Connecting Electronics Industries® announces a design conference including educational courses, technical presentations, designer certification workshops, and tabletop displays. Sponsored by the IPC Designers Council, it will run between June 23-28, 2008. Dr. Eric Bogatin and Dieter Bergman will lead the workshop on the manufacturability characteristics of the printed board and assembly, discussing various issues relating to the design development phase.
Original Press Release:
IPC Offers New Design Conference
Helping Designers Prepare for Tomorrow's Needs
BANNOCKBURN, Ill., USA, April 22, 2008 - IPC - Association Connecting Electronics Industries® announces a design conference including educational courses, technical presentations, designer certification workshops and tabletop displays that will give designers a step up on current industry trends and knowledge necessary to succeed. Sponsored by the IPC Designers Council, the educational courses will run June 23-24, 2008, the technical conference and displays will be held June 25, and the designer certification workshops will take place June 26-28 at the Courtyard Marriott Montreal Airport in Montreal.
The conference will offer exposure to the latest advancements in a host of design technologies that will give designers the edge they need to help keep their companies innovative and profitable. "Networking opportunities will also be an important part of this event," notes Jean Hebeisen, IPC Designers Council and professional development director. Educational workshop presenter and IPC director of technology transfer, Dieter Bergman, adds, "This seminar presents a valuable opportunity to share ideas and experiences that offer useful, real-world solutions to today's design challenges."
Dr. Eric Bogatin, president of Bogatin Enterprises, will join Bergman to lead the workshop on the manufacturability characteristics of the printed board and assembly, discussing the electrical implications of following only the DfM rules, and examining the optimum manufacturing solutions versus the most desirable for electrical performance. The workshop will also look at many of the important problems that occur during the design development phase and correlate these through the physical design of component packages, connectors, backplanes, and printed board stack-up conditions.
For additional information or to register for the conference, visit ipc.org/DesignConference0608 or contact Michelle Michelotti, IPC coordinator of professional development, at MichelleMichelotti@ipc.org or +1 847-597-2822.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
