IPC/JEDEC Conference to include 6 lead-free workshops.February 24, 2009 -
During IPC/JEDEC "Transitioning to Lead Free - Strategies for Implementation" conference, Ray Prasad, Werner Engelmaier, Dr. Jennie Hwang, and technical experts from DfR Solutions will look at critical issues for lead-free implementation, process, and reliability. Conference will cover supply chain communication for lead-free world, aerospace response to lead-free solder, lead-free implementation for SON and QFN devices, and mitigation of corrosion-induced tin whiskers.
Industry Experts Prasad, Engelmaier and Hwang Lead Workshops at Upcoming IPC/JEDEC Lead-Free Conference
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: February 20, 2009
BANNOCKBURN, Ill., USA, February 20, 2009 - Ray Prasad, Werner Engelmaier, Dr. Jennie Hwang, and technical experts from DfR Solutions will look at critical issues for lead-free implementation, process and reliability in workshops held at the IPC/JEDEC "Transitioning to Lead Free - Strategies for Implementation" conference in Santa Clara, Calif., taking place between March 3 and March 5.
The full-day conference on March 4 will cover such topics as: supply chain communication for a lead-free world, aerospace response to lead-free solder, lead-free implementation for small outline no-lead (SON) and quad flat no-lead (QFN) devices, mitigation of corrosion-induced tin whiskers, and more. Attendees can enhance the event's networking potential by bringing a colleague at no charge if they register for the technical conference by Thursday, February 26.
In addition to the in-depth technical conference, a series of workshops will be held before and after the conference on March 3 and March 5. The courses are:
PD-01: Four Ps of SMT in a Lead-Free World: Principles, Practice, Promises and Problems - Instructor: Ray Prasad. The objective of this course is to identify the technical issues in through hole, SMT, BGA, fine-pitch technology and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronic products for both tin-lead and lead free.
PD-02: Lead-Free Soldering Processes - Survival, Quality, Reliability - Instructor: Werner Engelmaier. This course will examine the three major threats to electronic product reliability: solder joint reliability, printed circuit board survival during soldering (and long-term reliability) and component survival during soldering processes and explore solutions that can help assure the reliability of electronic assemblies.
PD-03: Lead-Free Systems Performance & Reliability - Present & Future - Instructor: Dr. Jennie Hwang. This half-day course provides a holistic view of state-of-the-art lead-free performance and reliability, based on the speaker's three textbooks.
PD-04: BGA/CSP WLP Lead-Free Reliability in Packaging & Assembly - Instructor: Dr. Jennie Hwang. This course addresses critical questions and tackles prevalent issues related to lead-free BGA packages and assemblies, including reflow, production yields, compatibility between SAC balls with lead-free solder paste, and mixed use of lead-free and tin-lead.
PD-05: Understanding Failure and Root-Cause Analysis in Lead-Free Electronics - Instructor: John McNulty, DfR Solutions. This half-day course will use case studies to discuss failure mechanisms for lead-free component packaging, discrete components, printed boards and interconnects and the tools and techniques to identify those mechanisms.
PD-06: A Practical Guide to Managing Your Lead-Free Transition - Randy Schueller, DfR Solutions. Completion of this half-day course should prepare students for creating a comprehensive lead-free development plan for their own products.
For more information on the conference, or to register, visit ipc.org/LF0309 or contact IPC Professional Development Manager Anne Marie Mulvihill at +1 847-597-2827 or Registration@ipc.org.
IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.
JEDEC is the leading developer of standards for the solid-state industry. Almost 3,300 participants, appointed by some 295 companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.