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IPC Issues Report on Microelectronics - Who's Driving and How to Get There

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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: January 21, 2008

BANNOCKBURN, Ill., USA, January 21, 2008 - While the trend of miniaturization has been a prominent characteristic of the electronics industry, the race has become seemingly more difficult to maneuver, and the roadmaps increasingly complex to follow. To address the technology needs, challenges and opportunities that miniaturization presents to all segments of the industry, IPC - Association Connecting Electronics Industries® has issued, "Microelectronics: The Future of Miniaturization and its Impact on Electronics Manufacturing." Commissioned on behalf of IPC's Executive Market & Technology Forum members, this report assesses the drivers of miniaturization, and describes and analyzes the technologies that enable this miniaturization.

New research conducted by Prismark Partners of Cold Spring Harbor, N.Y., for this report focused on three major end-product industries - personal computers, hand-held electronics, and infrastructure equipment for the datacom/telecom industry - and addressed the leading original equipment manufacturers' technology roadmap requirements.

The report discusses Silicon-on-Chip (SoC) and System-in-Package (SiP) integration, as well as high density packaging, interconnects and assembly as important drivers for miniaturization. The report also identifies PCB embedded components as a key emerging technology for the next step in component and product miniaturization.

Furthermore, the study discusses the impact of miniaturization on the supply chain and how it drives certain technology and business shifts. It also offers a forecast of future technology needs and market opportunities for all segments of the electronic interconnect industry.

"The in-depth research that is conducted for reports like this one is not typically attainable by individual companies," explained Sharon Starr, IPC director of market research, "but as a member of the Executive Forum, a company can access the information at a fraction of the cost they would ordinarily pay to commission a proprietary study, and leverage the knowledge gained into better business performance."

Executive Market Forum members can receive the complete report at no charge. Other IPC Members may purchase the reports for $2000 for a single user or $2500 for a global license. The nonmember costs are $4000 (single user) and $5000 (global license). To purchase this report, visit ipc.org/onlinestore.

For information about IPC's market studies or IPC's Executive Market Forum, contact Sharon Starr, IPC director of market research, at +1 847-597-2817 or SharonStarr@ipc.org

About IPC IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

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