IPC Calls for Poster Abstracts for IPC APEX EXPO 2014.
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Press Release Summary:
IPC invites researchers, technical experts, and industry leaders to submit poster presentation abstracts for IPC APEX EXPO®, which will take place March 25–27, 2014 in Las Vegas, NV. Technical poster presentations are being sought on relevant electronics topics, including design, materials, assembly, processes, and equipment. Abstracts of up to 300 words summarizing technical and previously unpublished work should be submitted by December 22, 2013.
Original Press Release:
IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2014 in Las Vegas
BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment, especially:
• Advanced Technology
• Adhesives
• Area Array/Flip Chip/0201
• Assembly and Rework Processes
• BGA Packaging
• Black Pad and other Board Related Issues
• Business & Supply Chain Issues
• BTC/QFN/MLF
• Conformal coatings
• Counterfeit Electronics
• Design
• Electromigration
• Electronics Manufacturing Services
• Embedded Passive & Active Devices
• Environmental Compliance
• Lean Six Sigma
• Flexible Circuitry
• Head-on-Pillow, Component & Board Warpage
• HDI Technologies
• High Speed, High Frequency & Signal Integrity • Lead-Free Fabrication, Assembly & Reliability
• Microminiaturization
• Nanotechnology
• Optoelectronics
• Packaging & Components
• PCB Fabrication
• PCB and Component Storage & Handling
• 2.5-D/3-D Packaging
• Performance, Quality & Reliability
• PoP
• Photovoltaics
• Printed Electronics
• RFID Circuitry
• Soldering
• Surface Finishes
• Test, Inspection & AOI
• Tin Whiskers
• Underfills
• Via Plugging & Other Protection
Recognized by the Trade Show News Network (TSNN) as one of the top 250 trade shows in the United States, IPC APEX EXPO provides presenters with profile-raising exposure to thousands of key engineers, managers and executives of the industry’s leading companies. 3:30 pm–4:30 pm on Wednesday, March 26.
.An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by December 22, 2013, at www.IPCAPEXEXPO.org/CFPosters.
For more information about poster participation at IPC APEX EXPO, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.
More information on IPC APEX EXPO is available at www.IPCAPEXEXPO.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
