IPC Conference to address tin whiskers.
Press Release Summary:
March 29, 2012 - Scheduled for April 17-19, 2012, IPC Tin Whiskers Conference will focus on tin whisker growth, risk mitigation, detection, and failure analysis. Conference is sponsored by Lockheed Martin and will feature leading experts who will explore full range of whisker theory and practice for military/aerospace, automotive, medical, and consumer sectors. Three-day event will include 2 half-day workshops, 1 ½ day technical conference, and variety of presentations.
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive, Bannockburn, IL, 60015, USA
Original Press Release
Leading Experts Take Tin Whiskers from Theory to Practice at IPC Conference
Press release date: March 26, 2012
Are we understating the use of tin whisker risk mitigation methodologies?
BANNOCKBURN, Ill., USA, -Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17-19, 2012, in Ft. Worth, Texas. Sponsored by Lockheed Martin, the conference will feature the industry's leading experts who will explore the full range of whisker theory and practice for the military/aerospace, automotive, medical and consumer sectors.
"Tin whiskers have grown into a topic that never fails to arouse lively discussions amongst product designers and manufacturing personnel," says David Hillman, principal materials & process engineer, Rockwell Collins and conference speaker. "While the impact of tin whiskers is a very real phenomenon, predicting how and when they will occur still needs to be explored. The real questions: Are we being overly conservative about the impact of tin whiskers on products and are we understating the use of tin whisker risk mitigation methodologies?"
The one and a half-day technical conference will kick off on Wednesday, April 18, with a "State of Lead-Free" address by Linda Woody, engineering manager, Lockheed Martin Missile & Fire Control. Other presentations will explore: mitigation measurements and whisker survey of commercial components; effectiveness of photosintering in mitigating tin whisker formation; effects of magnetism on the morphology of lead-free solder and plating; tin-lead conversion process; mechanical and electrical properties of tin, zinc and cadmium whiskers; and whisker growth evidence, root cause, and countermeasures.
Thursday's conference presentations will begin with the keynote, "Design Simplicity and Collaboration - Advanced Practices for Reducing Lead-Free Risk," by Steven Betza, corporate director of electronics engineering & packaging, Lockheed Martin Systems Integration. Also on the agenda, presentations from representatives of the UK National Physical Laboratory (NPL), Bosch Automotive-Germany, Philips Healthcare, CALCE-University of Maryland, University of North Texas, Y-12 National Security Complex, AEM Inc., Celestica and Raytheon.
Prior to the technical conference, two half-day workshops will take place on April 17. In the morning session, Senior Research Scientist Michael Osterman, Ph.D., CALCE-University of Maryland, will educate attendees on tin whisker failure risk and mitigation strategies. In the afternoon, Lyudmyla Panashchenko, aerospace engineer, NASA Goddard Space Center, will present "The Art of Appreciating Metal Whiskers," providing an advanced level of practical guidance.
For more information on the IPC Tin Whiskers Conference or to register, visit www.ipc.org/tin-whiskers.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.