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IPC Conference focuses on meeting today's customer demands.

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October 10, 2008 - Scheduled for November 10-12, 2008, "IPC International Test and Inspection Technology Conference: Meeting Customer Demands" will provide snapshot of what methods and techniques are still in place and what is new in electronic product verification. Conference will cover components, materials, printed boards, assemblies, and OEM perspective. Attendees will explore different testing methods and strategies that verify sum and quality of parts used in assembly process.

IPC'S International Test And Inspection Conference Focuses on Meeting Today's Customer Demands


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: October 8, 2008

BANNOCKBURN, Ill., USA, October 8, 2008 - It is the responsibility of the production or project manager to ensure that his product meets customer expectations. Myriad process changes have taken place to restrict the use of certain substances in building electronic hardware. New methods and techniques are often necessary, and to provide a snapshot of what is still in place and what is new in product verification, IPC - Association Connecting Electronics Industries® has developed a three-day test and inspection conference. "IPC International Test and Inspection Technology Conference: Meeting Customer Demands" will take place November 10-12, 2008 in Santa Clara, Calif.

The conference will cover components, materials, printed boards, assemblies and the OEM perspective. Micheala Brody, cofounder of Zero Defects and program committee member, emphasizes, "Time is money. Rules have changed and test methodologies have become a collaborative activity between the end customer and the assembler. Manufacturing and test engineers from OEM to EMS companies looking for a thorough review of product verification - through testing and inspection - at each level of the manufacturing process must attend this conference."

Workshop presenter and IPC director of technology transfer, Dieter Bergman, explains, "The conference will examine the methods and practices currently used to validate the performance capability of electronic equipment. Attendees will explore different testing methods and strategies that verify the sum and quality of the parts used in the assembly process - electronic components, base materials, printed boards, application-specific subassemblies and more."

For additional information on the conference, including the full agenda and registration form, visit ipc.org/test.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai.

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