IPC Conference focuses on halogen- and lead-free solutions.October 20, 2009 -
Scheduled for Nov 11, IPC Materials Conference: Engineering for Compliance, will focus on understanding opportunities presented by new materials and technologies and their related reliability and performance. Joel Peiffer of 3M's Electronic Solutions Division will explore the issue in his paper, Reliability of Ultra-Thin Embedded Capacitor Laminates in Lead-Free Assembly, while keynote by Alan Rae will examine opportunities and challenges as nano-enabled products go mainstream in next 5 years.
IPC Materials Conference Offers New Materials and New Solutions For Halogen-Free and Lead-Free Problems
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: October 14, 2009
BANNOCKBURN, Ill., USA, October 14, 2009 - New technologies and materials present viable and reliable options for use in tomorrow's electronic products, even with the continuing proliferation of environmental regulation restrictions. As the electronics industry seeks to contain costs and find new efficiencies for high-density electronics, nanotechnology and embedded passives are offering new solutions to help the industry meet today's challenges. Understanding the opportunities presented by new materials and technologies and their related reliability and performance is the focus of the IPC Materials Conference: Engineering for Compliance, November 11, 2009, in Irvine, Calif.
Engineers have been concerned about the viability of embedded passives in conjunction with the higher temperatures required by lead-free materials. Joel Peiffer of 3M's Electronic Solutions Division will explore the issue in his paper, Reliability of Ultra-Thin Embedded Capacitor Laminates in Lead-Free Assembly. "I'm presenting data to help calm those fears, showing that even materials that have not been around a long time are extremely reliable," Peiffer said.
Another highlight of the conference will be a keynote by Alan Rae examining opportunities and challenges as nano-enabled products go mainstream in the next five years. Perhaps the biggest and earliest link between nano and printed board technology is the conductive inks that use nanotubes to improve conductivity. Rae predicts that companies in the printed board industry who start studying materials like these stand to benefit significantly during the coming decade.
The Materials Conference will feature comprehensive sessions examining performance and reliability issues related to halogen-free laminate and lead-free alloys. A panel will discuss the challenge and status of lead-free alloy proliferation.
The conference will be held in conjunction with IPC's "It's Not Easy Being Green: Complying with Changing Global Environmental Laws" conference on November 10. Information on both events is available at ipc.org/compliance-materials-conference.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.