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IPC Announces Winners of international academic competition.

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January 11, 2012 - Winning research papers of 2012 IPC International Academic Paper Competition were Low Temperature Lead-Free Assembly Via Transient Liquid Phase Sintering, by Joseph Flanagan; Measurement Study for Cross Section Versus X-ray Inspection, by Loc Nguyen; and Solder Fillet Height Workmanship Criteria for Castellated Solder Joints, by Tim Pearson. Authors of said papers will present their research at BUZZ session on March 1, 2012 at IPC APEX EXPO® in San Diego, CA.

IPC International Academic Competition Winners to Present Research at IPC APEX EXPO 2012


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: January 9, 2012

BANNOCKBURN, Ill., USA - IPC - Association Connecting Electronics Industries® is pleased to announce the winning research papers selected in the 2012 IPC International Academic Paper Competition: Low Temperature Lead-Free Assembly Via Transient Liquid Phase Sintering, by Joseph Flanagan, Purdue University Measurement Study for Cross Section Versus X-ray Inspection, by Loc Nguyen, San Jose State University Solder Fillet Height Workmanship Criteria for Castellated Solder Joints, by Tim Pearson, Iowa State University

The authors of these papers will present their research at a free BUZZ session on Thursday, March 1, 2012, at IPC APEX EXPO® in San Diego.

Open to all accredited U.S. and international colleges and universities with a strong focus on the electronics industry, this year's competition welcomed entries from around the world. The paper abstracts were judged by an IPC blue ribbon committee.

"It was an extremely difficult decision as all the entries were exceptional," says Greg Munie, Ph.D., IPC conference director. "I believe the top three selections are innovative and exemplary of the high level of research being conducted at the world's academic institutions, with great promise as valuable contributions to our industry."

In addition to being recognized by the industry at IPC APEX EXPO, each winning author will each receive an airfare allowance to travel to IPC APEX EXPO, free hotel accommodations and a free technical conference registration.

Industry professionals may register online for free exhibit hall registration and attend this session and other educational BUZZ sessions. IPC APEX EXPO is the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test.

To register for IPC APEX EXPO, or for more information on all of the activities taking place, including the industry's premier technical conference, professional development courses and standards development meetings, visit www.IPCAPEXEXPO.org.

About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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