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IPC APEX EXPO to feature 35 technical sessions.

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December 18, 2012 - Scheduled for February 19-21, 2013, IPC APEX EXPOŽ Technical Conference will cover two dozen technical topics in the areas of board fabrication, design, and electronics assembly. Over 3 days, 35 technical sessions with nearly 100 research papers will address military electronics, advanced packaging, fluxes and pastes, embedded devices, high-frequency electronics, and electrostatic discharge. Other areas will include rework/repair, cleaning, and assembly reliability.

Cleaning, Military and Printed Electronics, Solderability and Reliability Highlight IPC APEX EXPO Technical Conference


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: December 13, 2012

35 technical sessions with nearly 100 research papers

BANNOCKBURN, Ill., USA, — Featuring new research and innovations from industry experts around the world, the IPC APEX EXPOŽ Technical Conference on February 19–21, 2013, at the San Diego Convention Center, will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

“Conference attendees this year will find a lot of sessions that pertain directly to issues and concerns with production on the factory floor,” says IPC Technical Conference Director Greg Munie, Ph.D. “We have sessions covering defects like pad cratering and head on pillow; voiding; bare board testing and reliability; and rework for high-reliability assemblies. The information presented will reveal new paths and solutions for companies to take.”

Over three days, 35 technical sessions with nearly 100 research papers will address additional topics such as military electronics, advanced packaging, fluxes and paste, embedded devices, high-frequency electronics and electrostatic discharge. In addition, the areas of rework/repair, cleaning, assembly reliability, solder and alloy reliability, printing and printed electronics will have multiple sessions due to the wealth of information available.

“Printed electronics remains a growing and soon-to-be ubiquitous technology. One of the great benefits of the technical conference is the opportunity to network, ask questions and get answers to challenges across the supply chain,” Munie adds.

The complete list of technical conference sessions is available at www.IPCAPEXEXPO.org/conference.

For more information on the technical conference and other activities at IPC APEX EXPO, including professional development courses, standards development meetings and special events, visit www.IPCAPEXEXPO.org. Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by January 25 for any of the event’s paid activities will save 20 percent off registration fees. Registration packages offering additional savings can be viewed at www.IPCAPEXEXPO.org/registration-options.

About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen and Beijing, China.
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