IPC announces course offerings at APEX EXPO.
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Press Release Summary:
IPC APEX EXPO(TM) professional development courses will be held March 29, March 30, and April 2 at Mandalay Bay Resort and Convention Center in Las Vegas. Highlights include lean/Green SMT manufacturing, flexible circuit technology, implementing halgone-free circuit board assembly process, nanoelectronics, and lead-free technologies. Course descriptions and interactive online search by day, topic, instructor, or keyword are available on website.
Original Press Release:
IPC APEX EXPO Courses on Advanced and Lead-Free Technologies, Green Initiatives, and Reliability - The Hot Tickets in Vegas
BANNOCKBURN, Ill., USA, February 16, 2009 - With six weeks to go, and IPC APEX EXPO(TM) registrations exceeding expectations, Phil Zarrow and James Hall may see another standing-room-only event for their Lean and Green SMT Manufacturing course this year. The same holds true for other popular and well-respected industry experts presenting at the event, including Joe Fjelstad, Ray Prasad, Ron Lasky and Ken Gilleo. The IPC APEX EXPO professional development courses will be held Sunday, Monday and Thursday, March 29, 30 and April 2 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Unlike any other event in the world, IPC APEX EXPO brings the industry's elite together to provide comprehensive and intense educational updates in the areas of advanced technologies; design; green initiatives; lead-free technologies; materials; process improvements; solder joint reliability; and more.
"Our industry's technologies, materials and processes are continuously maturing. If you fall behind in understanding the new developments, you shortchange yourself and, as I trust any thoughtful company CEO would agree, your company's future. IPC APEX EXPO is the best and most cost-effective pathway to that knowledge," said Fjelstad, founder and president of Verdant Electronics. "In an industry as dynamic as ours, what you don't know CAN hurt you."
2009 course highlights include:
o Lean and Green SMT Manufacturing,
o Flexible Circuit Technology: Structures, Applications, Materials and Manufacturing Processes,
o Implementing a Halogen-Free Circuit Board Assembly Process,
o Nanoelectronics, MEMS and MOEMS: Products and Packages,
o Vapor-Phase or Convection Reflow Soldering for Lead-Free and Tin-Lead Assembly,
o Lead-Free Flip-Chip Wafer-Level Packaging for 3-D System-in-Packages and PCB Assemblies,
o Understanding Failure and Root-Cause Analysis in Lead-Free Electronics,
o and many more!
For complete course descriptions and an interactive online search by day, topic, instructor or keyword, visit www.IPCAPEXEXPO.org/profdev. Early-bird savings of 20 percent on course registrations and other fee-based IPC APEX EXPO activities expire March 4, 2009.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.
