Hypertronics Announces Micro-Miniature Form Factor for Connectors Using Licensed Ardent Concepts Contacts
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16 Brent Dr.
Hudson, MA, 01749 2978
Press release date: January 18, 2007
Hypertronics Licenses Ardent Concepts Contact Technology for Micro-Miniature Connectors
New Form Factor for Proven, Solderless Interconnects Optimized For Military/Aerospace Designs
Hudson, MA (January 18, 2007) - Hypertronics, the leading provider of high performance electrical connector and interconnect solutions, today announced a new micro-miniature connector technology optimized for high reliability, military/aerospace applications. Leveraging a contact system licensed from Ardent Concepts, the new HyperGrid(TM) technology features:
o Ardent Concepts' RC Springprobe(TM) contact technology proven in rugged test bed applications;
o Solderless, compression style connections requiring only 20 grams of force per node to maintain connectivity, with a contact pitch as low as 0.4 mm, ideal for high density designs;
o Excellent AC performance, with multi-GHz bandwidth, exceptional signal integrity and consistent DC resistance; and
o Unequaled durability, that exceeds 100K compression cycles, with excellent shock and vibration performance.
HyperGrid technology results in interconnect solutions that offer the same tiny form factor, high node count and stackability features required in many micro-miniature applications, without the electrical, repeatability or cost limitations associated with other technologies such as pogo pins, fuzz buttons, and conductive elastomers.
"Ardent's patented contact technology provides superior performance, size and cost advantages that are production-proven in other high-reliability applications," said Gordon Vinther, President of Ardent Concepts. "Hypertronics' expertise in meeting mil/aero requirements makes them an ideal partner for driving our contact technology into this market,"
The new scalable HyperGrid(TM) technology will be available as custom interconnects for PCB-to-PCB, flex cable-to-PCB, and IC-to-PCB designs.
This new form factor opens portable, handheld, avionic and other space and weight constrained applications to the high reliability, repeatability and rugged designs of Hypertronics . The license agreement with Ardent Concepts is exclusive for military/aerospace applications allowing Hypertronics to provide specialized mil/aero customers a unique interconnect solution not available with any other vendor.
"Hypertronics is always looking to acquire technologies that are complimentary to our high-reliability Hypertac ® hyperboloid contact design," said Garry MacDonald, Hypertronics Vice President of Engineering and Business Development. "This license agreement with Ardent Concepts enables Hypertronics to expand its custom interconnect solutions to new applications requiring micro-miniature form factors."
About Hypertronics Corporation
Hypertronics, based in Hudson, Massachusetts, has been a leader in the design, manufacturing and distribution of specialty connectors for the electronics industry since 1970. Its Hypertac ® technology is renowned for delivering unfailing performance in high-reliability applications in the medical, military/aerospace, test and measurement and industrial market segments. The company offers a wide range of standard catalog products as well as custom-designed connectors for more specific application needs and performance requirements.
Hypertronics connectors are used by leading mil/aero customers whose mission-critical land, naval and aerospace systems require fail-safe performance under the harshest of operating environments. Applications include communications and information systems, sensors and electronics, weapons, ground/sea systems, air platforms, deep space systems and missile defense. It is a wholly owned subsidiary of Smiths Group (UK:SMIN), a multinational company headquartered in London, UK. More information about Hypertronics products and solution offerings can be found at www.hypertronics.com.
For more information, please contact:
Aubrey Vachon Marketing Communications Specialist, Hypertronics
Tel.: +1 978 568 0451 x343, Email: firstname.lastname@example.org