Henkel to Showcase Core Materials Technologies at Productronica 2005
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Henkel Loctite Corporation
1001 Trout Brook Crossing, P.O. Box 4016
Rocky Hill, CT, 06067
Press release date: October 6, 2005
Henkel prepares to present a range of product and material sets innovations during November 15-18, on booth A3.153, Hall A3.
With the deadline to Go Lead-Free now less than 12 months away, a major priority for many Productronica visitors will be the implementation of compliant processes. With a new sense of urgency fuelling the global transition to lead-free, the electronics group of Henkel will use Productronica 2005 to exhibit its comprehensive lead-free product range.
This incorporates the Multicore® solder paste, flux and wire solutions and Loctite® surface mount adhesives - designed to withstand the greater rigors of lead-free wave soldering whilst preventing chip loss. In addition, Henkel will exhibit a range of Hysol® underfills, dam & fill encapsulants, die attach adhesives and semiconductor molding compounds, again all optimised for the elevated lead-free process temperatures.
Some of Henkel's extensive range of lead-free solutions will be exhibited at Global SMT's Lead-Free Interactive Forum, taking place in Hall A6 and open to all delegates. "Productronica 2005 is a great final opportunity for manufacturers to actively engage in the lead-free process," explains Frank Ongkiehong, Director of Application Engineering / Marketing Europe. "There is no way of avoiding the impact of lead-free, but it is possible to Go Lead-Free easily and successfully as long as materials and processes match together and required support is provided. During Productronica, visitors will discover how Henkel's blend of technical expertise and industry knowledge is already driving next generation processes."
As the race against time to Go Lead-Free begins, Henkel's inclusion of the successful Team McLaren Mercedes MP4-20 Formula 1 car on its stand is particularly appropriate. The Henkel-sponsored vehicle will be on show for the duration of the event. Attendees will find out first hand how the car is able to withstand the demanding conditions of today's F1 circuits, whilst simultaneously learning how their processes can stand up to the demanding conditions of the new lead-free environment. Henkel prides itself on the success of its high technology materials products in the F1 race car. With more than 100 different applications on the car, Henkel is proud to have contributed to the success that Team McLaren Mercedes has achieved this year.
The lead-free transition is also fuelling the growing demand for compatible material sets, delivered by suppliers who manage every stage of the manufacturing process. Henkel will use Productronica 2005 to showcase its streamlined, cost-effective material sets capability. "The imposition of environmental concerns does not remove the need to continually decrease manufacturing cost and maintain fast product development cycles for consistent product reliability and compatibility," comments Ongkiehong. "It is for this reason that modern manufacturers are increasingly adopting our material sets, incorporating Henkel's renowned expertise at every stage - from semiconductor package material compatibility all the way through to board level assembly."
In addition to this comprehensive lead-free and material sets expertise, the Henkel stand will feature a demonstration of Macromelt® technology, illustrating exactly how this innovative low pressure molding technique is ideally formulated for encapsulating fine or fragile circuitry, providing manufacturers with significant operational flexibility across a variety of applications, customer needs and markets. Henkel's Macromelt polyamide materials allow for a self-contained and highly integrated assembly, eliminating the need for casings or enclosures, multiple assembly processes and gasketing or sealing issues.