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Henkel to Show Proven Materials Solutions; Launch New Products at APEX 2007

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(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Henkel Corporation
One Henkel Way
Rocky Hill, CT, 06067
USA



Press release date: February 5, 2007

With a banner year under its belt, Henkel is set to start 2007 in full stride when it debuts several new products and displays its field-proven materials solutions at APEX 2007 from February 20 - 22 at the Los Angeles Convention Center. The materials leader's complete product offerings for the entire semiconductor packaging and PCB assembly value chains will be on display at the event, and Henkel experts will be on-hand to discuss the company's latest research and most innovative new material offerings.

Henkel's MulticoreŽ brand of solder products will be one of the main highlights of the exhibit, with lead-free and mixed-metal-optimized solder products along with the company's award-winning flux solutions on display. Central to the line-up is Multicore LF328, Henkel's new low-voiding, lead-free solder paste formulation. By nature, many lead free solder pastes are more prone to the formation of volatiles and, thus, solder joint void formation. By altering the flux system to reduce volatiles, Henkel scientists developed Multicore LF328, a solder paste solution that not only reduces voids by as much as 50% but delivers long open and abandon times, a wide process window and a robust, halide-free, no-clean material that can accommodate high-volume stencil printing for CSP lead pitches of 0.4mm. Also part of Henkel's APEX 2007 lead-free display is its latest flux offering: Multicore MFR301. This unique flux system is compatible with lead-free and traditional tin-lead wave soldering processes and delivers sustained performance and a maximum process window. Unlike competitive materials with higher activity which may impart damage to the PCB, Multicore MFR301's activity level is powerful enough to enable soldering to the most difficult surfaces yet is not harmful to PCBs.

Throughout the 3-day event, Henkel will also show its latest underfill solution: LoctiteŽ 3536. Developed specifically for use with today's advanced CSP and BGA packages, Loctite 3536 delivers unmatched joint protection and enables long-term performance for modern handheld devices. A high-flow, lead-free compatible underfill system, Loctite 3536 delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices has shown that Loctite 3536 offers five times the reliability over non-underfilled Pb-free devices.

In addition to Henkel's award-winning PCB assembly materials, solutions for advanced packaging manufacture will also be showcased at the APEX event. Semiconductor packaging materials have long been a hallmark of Henkel's complete materials portfolio, with solutions for die attach, wafer-level underfills and mold compounds continuing to break new ground and provide cost-effective, single-source solutions for today's packaging specialists. With the recent acquisition of solder sphere leader Accurus Scientific Company Limited, Henkel's global footprint and breadth of product offering are unrivaled. Henkel is completely unique in its ability to effectively deliver leading-edge materials that address the majority of semiconductor packaging or PCB assembly requirements.

Visitors are invited to Henkel's booth, #2001, at APEX 2007 to discuss in-depth these latest materials advancements in addition to the company's complete value chain product offerings including; board protection materials, die attach solutions, wafer-level underfills, mold compounds, thermal management products, solder solutions, and adhesives. For more information, log onto www.henkelelectronics.com or call the company's Irvine, California headquarters at 949-789-2500.

About the electronics group of Henkel

Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics industry.

Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal Care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. In fiscal 2005 Henkel generated sales of 11.974 billion euros. A leader in brands and technologies, Henkel makes people's lives easier, better, and more beautiful. More than 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel.

Contact
Doug Dixon
Henkel Corporation
doug.dixon@us.henkel.com
Phone: 949-789-2500
Fax: 949-785-2595
www.electronics.henkel.com
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