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Henkel to Present Latest Research and Show Current Materials Innovations at Upcoming ATExpo Event

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Henkel to Present Latest Research and Show Current Materials Innovations at Upcoming ATExpo Event
Henkel to Present Latest Research and Show Current Materials Innovations at Upcoming ATExpo Event
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(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Henkel Corporation
One Henkel Way
Rocky Hill, CT, 06067
USA



Press release date: September 7, 2006

Irvine, California, September 7, 2006- With several new products on display and leading technical staff set to present four papers on the company's latest ground-breaking materials research, Henkel is poised to be one of the main attractions at the upcoming Assembly Technology Expo (ATExpo), scheduled to take place September 26-28, 2006 in Rosemont, Illinois.

Henkel Applications Engineering Team Leader and renowned industry materials expert, Dr. Brian Toleno, ranks among the star speakers at this year's Chicago-based conference, teaching a short course on board level underfills and presenting two papers on the company's pioneering research into lead-free reliability enhancement. Toleno's paper entitled "Improved BGA Shock and Bend Performance Using Corner Glue Epoxies", which is co-authored with Michael Kochanowski from Intel Corporation, will be presented at 3:30 p.m. on September 26th. Findings from studies conducted by a team of Henkel scientists and engineers on drop testing reliability will be discussed during the "CSP Solder Joint Drop Testing Reliability: Pb-free vs. Sn/Pb and Methods for Reliability Improvement" presentation, scheduled for 10:00 a.m. on September 27th. In addition to Dr. Toleno's technical sessions, Henkel materials expert Michael Pierce will present information on the company's revolutionary low-pressure molding solution, Macromelt®. "Manufacturing Improvements Enabled by New Low-Pressure Molding Process", co-authored by Henkl's Pierce and Cavist Corporation's Reimer Hansen, will be presented at 3:30 p.m. on Wednesday, September 27th.

Further to the valuable information received during the Henkel presentations, visitors to the Henkel booth, #5026, will see first hand why the materials leader continues to garner top honors and earn customer accolades for its innovative materials technology. Among the products on display will be Henkel's Loctite® Bead-on-Bead technology, a unique two-part, no-mix, no-measure thermally conductive adhesive that replaces traditional, solvent activated systems and the pot life management issues that accompany the older technology. Loctite Bead-on-Bead delivers significant product advancements including a 40% improvement in cooling performance over previous products, as well as tremendous ease-of-use enhancements. Henkel's ground-breaking Macromelt low-pressure molding solution will also be exhibited at the booth, with live demonstrations of the unique and simple encapsulation process taking place on-demand.

Throughout the three day event, Henkel will show some of its most innovative lead-free materials, including the company's high-performance lead-free solder paste, Multicore® LF318. With an extremely wide process window, Multicore LF318 delivers the benefits of long open time and superior tack life, which both translate to very low paste wasteage. In addition, the material has high resistance to humidity and performs well in any climate, making it ideal for manufacturers who wish to qualify a single, lead-free paste for their global manufacturing requirements. Also key to Henkel's complete lead-free portfolio, is the materials leader's latest advancements in adhesive technology. With guaranteed RoHS compliance and lead-free capability, Henkel's Loctite 3629 Chipbonder® delivers all of the benefits of a low-temperature cure adhesive with the strength and chemical stability required to withstand the elevated temperatures of lead-free.

To find our more about Henkel's materials research and development initiatives or to discuss the company's commercially available next-generation products, please visit Henkel in booth #5026 at ATExpo 2006 (www.atexpo.com).

About the electronics group of Henkel

Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics industry.

Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".

Contact Henkel Corporation Doug Dixon doug.dixon@us.henkel.com Phone: 949-789-2500 Fax: 949-785-2595 www.electronics.henkel.com
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